NB3H83905C
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14
PACKAGE DIMENSIONS
QFN20 4x4, 0.5P
CASE 485BH
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
A
D
E
B
C0.15
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
K
D2
E2
C
C0.15
C0.10
C0.08
A1
SEATING
PLANE
e
20X
NOTE 3
b
20X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 −−− 0.05
b 0.20 0.30
D 4.00 BSC
D2 2.60 2.80
E 4.00 BSC
E2 2.60 2.80
e 0.50 BSC
K 0.20 −−−
L 0.35 0.45
6
11
16
20X
0.50
PITCH
4.30
0.60
4.30
DIMENSIONS: MILLIMETERS
0.35
20X
1
L
A3 0.20 REF
MOUNTING FOOTPRINT*
NOTE 4
A3
DETAIL B
2.80
2.80
1
PACKAGE
OUTLINE
DETAIL A
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
L1 0.00 0.15
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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