TDA7439 Package information
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8 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
SDIP30 (0.400")
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 5.08 0.20
A1 0.51 0.020
A2 3.05 3.81 4.57 0.12 0.15 0.18
B 0.36 0.46 0.56 0.014 0.018 0.022
B1 0.76 0.99 1.40 0.030 0.039 0.055
C 0.20 0.25 0.36 0.008 0.01 0.014
D 27.43 27.94 28.45 1.08 1.10 1.12
E 10.16 10.41 11.05 0.400 0.410 0.435
E1 8.38 8.64 9.40 0.330 0.340 0.370
e 1.778 0.070
e1 10.16 0.400
L 2.54 3.30 3.81 0.10 0.13 0.15
M0°(min.), 15°(max.)
S 0.31 0.012
OUTLINE AND
MECHANICAL DATA
Outline and mechanical data
SDIP30 (0.400 in.)
Obsolete Product(s) - Obsolete Product(s)
