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EVAL-ADM1023EB

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
ACPI-Compliant, High Accuracy
Microprocessor System Temperature Monitor
ADM1023
©2008 SCILLC. All rights reserved. Publication Order Number:
January 2008 – Rev. 8 ADM1023/D
FEATURES
Next generation upgrade of ADM1021
On-chip and remote temperature sensing
Offset registers for system calibration
1°C accuracy and resolution on local channel
0.125°C resolution/1°C accuracy on remote channel
Programmable over/under temperature limits
Programmable conversion rate
Supports system management bus (SMBus)
ALERT
2-wire SMBus serial interface
200 μA max operating current (0.25 conversions/second)
1 μA standby current
3 V to 5.5 V supply
Small 16-lead QSOP package
APPLICATIONS
Desktop computers
Notebook computers
Smart batteries
Industrial controllers
Telecomm equipment
Instrumentation
GENERAL DESCRIPTION
The ADM1023
1
is a 2-channel digital thermometer and under-
and overtemperature alarm for use in personal computers and
other systems requiring thermal monitoring and management.
Optimized for the Pentium® III, the higher accuracy allows
systems designers to safely reduce temperature guard banding
and increase system performance. The device can measure the
temperature of a microprocessor using a diode-connected PNP
transistor, which may be provided on-chip with the Pentium III
or similar processors; or it can be a low-cost, discrete NPN/PNP
device such as the 2N3904/2N3906. A novel measurement
technique cancels out the absolute value of the transistor’s base
emitter voltage so that no calibration is required. The second
measurement channel measures the output of an on-chip
temperature sensor to monitor the temperature of the device
and its environment.
The ADM1023 communicates over a 2-wire serial interface
compatible with SMBus standards. Under- and overtemperature
limits can be programmed into the device over the serial bus,
and an
ALERT
output signals when the on-chip or remote
temperature is out of range. This output can be used as an
interrupt or as an SMBus
ALERT
.
FUNCTIONAL BLOCK DIAGRAM
ON-CHIP
TEMPERATURE
SENSOR
A-TO-D
CONVERTER
BUSY RUN/STANDBY
EXTERNAL DIODE OPEN-CIRCUIT
ADDRESS POINTER
REGISTER
ONE-SHOT
REGISTER
CONVERSION RATE
REGISTER
OFFSET
REGISTERS
REMOTE TEMPERATURE
HIGH-LIMIT REGISTERS
CONFIGURATION
REGISTER
INTERRUPT
MASKING
SMBus INTERFACE
LOCAL TEMPERATURE
LOW-LIMIT COMPARATOR
LOCAL TEMPERATURE
HIGH-LIMIT COMPARATOR
REMOTE TEMPERATURE
LOW-LIMIT COMPARATOR
REMOTE TEMPERATURE
HIGH-LIMIT COMPARATOR
REMOTE TEMPERATURE
VALUE REGISTERS
LOCAL TEMPERATURE
VALUE REGISTER
STATUS REGISTER
NC V
DD
GNDNC GND NC NC NC SDATA SCLK ADD0 ADD1
ALERT
STBY
D+
D–
REMOTE TEMPERATURE
LOW-LIMIT REGISTERS
LOCAL TEMPERATURE
HIGH-LIMIT REGISTER
LOCAL TEMPERATURE
LOW-LIMIT REGISTER
ANALOG
MUX
NC = NO CONNECT
ADM1023
3
4
1 2 5 7 8 9 13 16 12 14 10 6
11
15
00058-001
Figure 1.
1
Protected by U.S. Patents 5,195,827; 5,867,012; 5,982,221; 6,097,239; 6,133,753; 6,169,442; other patents pending.
ADM1023
Rev. 8 | Page 2 of 18 | www.onsemi.com
TABLE OF CONTENTS
Specifications .....................................................................................3
Absolute Maximum Ratings ............................................................4
Thermal Characteristics...............................................................4
ESD Caution ..................................................................................4
Pin Configuration and Function Description...............................5
Typical Performance Characteristics..............................................6
Theory of Operation.........................................................................8
Functional Description ................................................................8
Measurement Method ..................................................................9
Sources of Errors on Thermal Transistors Measurement
Method ...........................................................................................9
Temperature Data Format..........................................................10
Register Functions ......................................................................10
Serial Bus Interface .....................................................................12
Address Pins ................................................................................12
ALERT
Output ............................................................................14
Low Power Standby Modes .......................................................15
Sensor Fault Detection...............................................................15
Applications .....................................................................................16
Factors Affecting Accuracy .......................................................16
Layout Considerations ...............................................................16
Application Circuits....................................................................17
Outline Dimensions........................................................................18
Ordering Guide...........................................................................18
REVISION HISTORY
01/08 - Rev 8: Conversion to ON Semiconductor
7/05—Rev. G to Rev. H
Changes to Table 1 ............................................................................ 3
2/05—Rev. F to Rev. G
Updated Format ..................................................................Universal
Changes to Specifications................................................................. 3
Changes to Absolute Maximum Ratings........................................ 4
Changes to Figure 14 ........................................................................ 8
Changes to Figure 21 ...................................................................... 17
Changes to Ordering Guide........................................................... 18
4/03—Rev. E to Rev. F
Added Reference to Figure 1 ........................................................... 2
4/03—Rev. D to Rev. E
Added ESD Caution ......................................................................... 3
Updated Outline Dimensions ....................................................... 13
9/02—Rev. C to Rev. D
Outline Dimensions updated .......................................................... 13
5/02—Rev. B to Rev. C
Figures 2 to 11 changed to TPCs 1–10, renumbered figures
accordingly......................................................................................... 4
Text change to Figure 9 (TPC 8) ..................................................... 5
Callouts in text added for Tables IV–VI ........................................ 8
Change to Serial Bus Interface section........................................... 9
4/00—Revision 0: Initial Version
ADM1023
Rev. 8 | Page 3 of 18 | www.onsemi.com
SPECIFICATIONS
T
A
= T
MIN
to T
MAX
1
, V
DD
= 3.0 V to 3.6 V, unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER SUPPLY AND ADC
Temperature Resolution, Local Sensor 1 °C Guaranteed no missed codes
Temperature Resolution, Remote Sensor 0.125 °C Guaranteed no missed codes
Temperature Error, Local Sensor −1.5 ±0.5 +1.5 °C T
A
= 60°C to 100°C
−3 ±1 +3 °C T
A
= 0°C to 120°C
Temperature Error, Remote Sensor −1 +1 °C T
A
, T
D
= 60°C to 100°C
2
−3 +3 °C T
A
, T
D
= 0°C to 120°C
2
Relative Accuracy 0.25 °C T
A
= 60°C to 100°C
Supply Voltage Range
3
3 3.6 V
Undervoltage Lockout Threshold 2.55 2.7 2.8 V V
DD
input, disables ADC, rising edge
Undervoltage Lockout Hysteresis 25 mV
Power-On Reset Threshold 0.9 1.7 2.2 V V
DD
, falling edge
4
POR Threshold Hysteresis 50 mV
Standby Supply Current 1 5 μA V
DD
= 3.3 V, no SMBus activity
4 μA SCLK at 10 kHz
Average Operating Supply Current 130 200 μA 0.25 conversions/sec rate
Autoconvert Mode, Averaged Over 4 Sec 225 370 μA 2 conversions/sec rate
Conversion Time 65 115 170 ms From stop bit to conversion complete
(both channels) D+ forced to D− + 0.65 V
Remote Sensor Source Current 120 205 300 μA High level
4
7 12 16 μA Low level
4
D-Source Voltage 0.7 V
Address Pin Bias Current (ADD0, ADD1) 50 μA Momentary at power-on reset
SMBus INTERFACE See Figure 3
Logic Input High Voltage, V
IH
2.2 V V
DD
= 3 V to 5.5 V
STBY
, SCLK, SDATA
Logic Input Low Voltage, V
IL
0.8 V V
DD
= 3 V to 5.5 V
STBY
, SCLK, SDATA
SMBus Output Low Sink Current 6 mA SDATA forced to 0.6 V
ALERT
Output Low Sink Current
1 mA
ALERT
forced to 0.4 V
Logic Input Current, I
IH
, I
IL
−1 +1 μA
SMBus Input Capacitance, SCLK, SDATA 5 pF
SMBus Clock Frequency 400 kHz
SMBus Clock Low Time, t
LOW
1.3 μs t
LOW
between 10% points
SMBus Clock High Time, t
HIGH
0.6 μs t
HIGH
between 90% points
SMBus Start Condition Setup Time, t
SU:STA
0.6 μs
SMBus Start Condition Hold Time, t
HD:STA
0.6 μs Time from 10% of SDATA to 90% of SCLK
SMBus Stop Condition Setup Time, t
SU:STO
0.6 μs Time from 90% of SCLK to 10% of SDATA
SMBus Data Valid to SCLK Rising Edge Time, t
SU:DAT
100 ns Time for 10% or 90% of SDATA to 10% of SCLK
SMBus Bus Free Time, t
BUF
1.3 μs Between start/stop condition
SCLK SDATA Rise Time, t
R MAX
300 ns Master clocking in data
SCLK SDATA Fall Time, t
F MAX
300 ns V
DD
= 0 V
1
T
MAX
= 120°C, T
MIN
= 0°C.
2
T
D
is the temperature of the remote thermal diode; T
A
, T
D
= 60°C to 100°C.
3
Operation at V
DD
= 5 V guaranteed by design; not production tested.
4
Guranteed by design; not production tested.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

EVAL-ADM1023EB

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