ADM1023
Rev. 8 | Page 4 of 18 | www.onsemi.com
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameters Ratings
Positive Supply Voltage (V
DD
) to GND −0.3 V to +6 V
D+, ADD0, ADD1 −0.3 V to V
DD
+ 0.3 V
D− to GND −0.3 V to +0.6 V
SCLK, SDATA,
ALERT
,
STBY
−0.3 V to +6 V
Input Current ±50 mA
Input Current, D− ±1 mA
ESD Rating, All Pins (Human Body Model) 2000 V
Continuous Power Dissipation
Up to 70°C 650 mW
Derating Above 70°C 6.7 mW/°C
Operating Temperature Range −55°C to +125°C
Maximum Junction Temperature (T
J MAX
) 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering 10 sec) 300°C
IR Reflow Peak Temperature 220°C
IR Reflow Peak Temperature for Pb-Free 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
16-lead QSOP package:
θ
JA
= 105°C/W
θ
JC
= 39°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
