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TC429CPA

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
2002-2012 Microchip Technology Inc. DS21416D-page 13
TC429
8-Lead Ceramic Dual In-line – 300 mil (CERDIP)
10.169.158.13.400.360.320
eB
Overall Row Spacing
0.510.460.41.020.018.016BLower Lead Width
1.651.401.14.065.055.045
B1
Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
5.084.133.18.200.163.125LTip to Seating Plane
10.169.789.40.400.385.370DOverall Length
7.626.735.84.300.265.230
E1
Ceramic Pkg. Width
8.137.757.37.320.305.290EShoulder to Shoulder Width
1.020.770.51.040.030.020
A1
Standoff §
5.084.574.06.200.180.160ATop to Seating Plane
2.54.100
p
Pitch
88
n
Number of Pins
MAX
NOM
MINMAX
NOM
MINDimension Limits
MILLIMETERSINCHES*Units
JEDEC Equivalent: MS-030
Drawing No. C04-010
*Controlling Parameter
1
2
D
n
E1
c
eB
E
p
L
A2
B
B1
A
A1
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC429
DS21416D-page 14 2002-2012 Microchip Technology Inc.
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Foot Angle
048048
1512015120
Mold Draft Angle Bottom
1512015120
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146E1Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004A1Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21416D-page 15
TC429
6.0 REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

TC429CPA

Mfr. #:
Buy TC429CPA
Manufacturer:
Microchip Technology
Description:
Gate Drivers 6A Power
Lifecycle:
New from this manufacturer.
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