ADG4612/ADG4613
Rev. 0 | Page 10 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
TOP VIEW
(Not to Scale)
1
2
3
4
5
6
7
8
ADG4612/
ADG4613
NC = NO CONNECT
16
15
14
13
12
11
10
9
D1
S1
V
SS
D4
S4
GND
IN1
D2
S2
V
DD
D3
IN4 IN3
S3
NC
IN2
09005-002
Figure 2. TSSOP Pin Configuration
PIN 1
INDICATOR
NOTES
1. EXPOSED PAD TIED TO SUBSTRATE, GND.
2. NC = NO CONNECT.
1S1
2V
SS
3GND
4S4
11 V
DD
12 S2
10 NC
9S3
5
D4
6
IN4
7
IN
3
8
D3
15
IN1
16
D1
14
IN2
13
D2
TOP VIEW
(Not to Scale)
ADG4612/
ADG4613
09005-003
Figure 3. LFCSP Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
TSSOP LFCSP
Mnemonic Description
1 15 IN1 Logic Control Input 1. This pin has an internal 400 kΩ pull-down resistor to GND.
2 16 D1 Drain Terminal 1. Can be an input or output.
3 1 S1 Source Terminal 1. Can be an input or output.
4 2 V
SS
Most Negative Power Supply Potential.
5 3 GND Ground (0 V) Reference.
6 4 S4 Source Terminal 4. Can be an input or output.
7 5 D4 Drain Terminal 4. Can be an input or output.
8 6 IN4 Logic Control Input 4. This pin has an internal 400 kΩ pull-down resistor to GND.
9 7 IN3 Logic Control Input 3. This pin has an internal 400 kΩ pull-down resistor to GND.
10 8 D3 Drain Terminal 3. Can be an input or output.
11 9 S3 Source Terminal 3. Can be an input or output.
12 10 NC No Connection.
13 11 V
DD
Most Positive Power Supply Potential.
14 12 S2 Source Terminal 2. Can be an input or output.
15 13 D2 Drain Terminal 2. Can be an input or output.
16 14 IN2 Logic Control Input 2. This pin has an internal 400 kΩ pull-down resistor to GND.
N/A 0 EPAD
The exposed pad is connected to the substrate GND. For best heat dissipation, it is
recommended that this pad be connected to GND. If heat dissipation is not a concern,
it is possible to leave the pad floating. Connecting the exposed pad to V
SS
(if V
SS
is not
equal to GND) can cause current to flow and can damage the part.
Table 9. ADG4612 Truth Table
ADG4612 INx Switch Condition
1 On
0 Off
Table 10. ADG4613 Truth Table
ADG4613 INx S1, S4 S2, S3
0 Off On
1 On Off