AQD-D3L2GN16-SQ

240Pin DDR3L 1600 UDIMM
2GB Based on 256Mx8
AQD-D3L2GN16-SQ
7
IDD Specification parameters Definition
( IDD values are for full operating range of Voltage and Temperature)
2GB, 256Mx64 Module(1 Rank x8)
Parameter
Symbol
DDR3L 1600 CL11
Unit
Operating One bank Active-Precharge current; tCK = tCK(IDD), tRC = tRC(IDD),
tRAS = tRASmin(IDD); CKE is HIGH, /CS is HIGH between valid commands;Address bus
inputs are SWITCHING; Data bus inputs are SWITCHING
IDD0
480
mA
Operating One bank Active-read-Precharge current; IOUT = 0mA; BL = 8, CL =
CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD =
tRCD(IDD); CKE is HIGH, /CS is HIGH between valid commands; Address bus inputs are
SWITCHING; Data pattern is same as IDD4W
IDD1
600
mA
Precharge power-down current; All banks idle; tCK = tCK(IDD); CKE is LOW; Other
control and address bus inputs are STABLE; Data bus inputs are FLOATING
IDD2P
264
mA
Precharge quiet standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH,
/CS is HIGH; Other control and address bus inputs are STABLE; Data bus inputs are
FLOATING
IDD2Q
264
mA
Precharge standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH, /CS is
HIGH; Other control and address bus inputs are SWITCHING; Data bus inputs are
SWITCHING
IDD2N
280
mA
Active power - down current; All banks open; tCK = tCK(IDD); CKE is LOW; Other
control and address bus inputs are STABLE; Data bus inputs are FLOATING
IDD3P
376
mA
Active standby current; All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP
= tRP(IDD); CKE is HIGH, /CS is HIGH between valid commands; Other control and
address bus inputs are SWITCHING; Data bus inputs are SWITCHING
IDD3N
416
mA
Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD);
CKE is HIGH, /CS is HIGH between valid commands; Address bus inputs are
SWITCHING; Data pattern is same as IDD4W
IDD4R
1120
mA
Operating burst write current; All banks open, Continuous burst writes; BL = 8, CL
= CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is
HIGH, /CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data
bus inputs are SWITCHING IDD4R
IDD4W
1000
mA
Burst refresh current; tCK = tCK(IDD); Refresh command at every tRFC(IDD)
interval; CKE is HIGH, /CS is HIGH between valid commands; Other control and address
bus inputs are SWITCHING; Data bus inputs are SWITCHING
IDD5
1520
mA
Self refresh current; CK and /CK at 0V; CKE 0.2V; Other control and address bus
inputs are FLOATING; Data bus inputs are FLOATING
IDD6
96
mA
Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA;
BL = 8, CL = CL(IDD), AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), Trc = tRC(IDD),
tRRD = tRRD(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS is HIGH between valid
commands;Address bus inputs are STABLE during DESELECTs; Data pattern is same
as IDD4R;
IDD7
1760
mA
Note:
1.Module IDD was calculated on the specific brand DRAM(4xnm) component IDD and can be differently
measured according to DQ loading capacitor.
240Pin DDR3L 1600 UDIMM
2GB Based on 256Mx8
AQD-D3L2GN16-SQ
8
Timing Parameters & Specifications
Speed
DDR3 1600
Unit
Parameter
Symbol
Min
Max
Average Clock Period
tCK
1.25
<1.5
ns
CK high-level width
tCH
0.47
0.53
tCK
CK low-level width
tCL
0.47
0.53
tCK
DQS, /DQS to DQ skew, per group,
per access
tDQSQ
-
100
ps
DQ output hold time from DQS, /DQS
tQH
0.38
-
tCK
DQ low-impedance time from CK, /CK
tLZ(DQ)
-450
225
ps
DQ high-impedance time from CK,
/CK
tHZ(DQ)
-
225
ps
Data setup time to DQS, /DQS
reference to Vih(ac)Vil(ac) levels
tDS
10
-
ps
Data hold time to DQS, /DQS
reference to Vih(ac)Vil(ac) levels
tDH
45
ps
DQ and DM input pulse width for each
input
tDIPW
360
-
ps
DQS, /DQS Read preamble
tRPRE
0.9
-
tCK
DQS, /DQS differential Read
postamble
tRPST
0.3
-
tCK
DQS, /DQS Write preamble
tWPRE
0.9
-
tCK
DQS, /DQS Write postamble
tWPST
0.3
-
tCK
DQS, /DQS low-impedance time
tLZ(DQS)
-450
225
ps
DQS, /DQS high-impedance time
tHZ(DQS)
-
225
ps
DQS, /DQS differential input low pulse
width
tDQSL
0.45
0.55
tCK
DQS, /DQS differential input high
pulse width
tDQSH
0.45
0.55
tCK
DQS, /DQS rising edge to CK, /CK
rising edge
tDQSS
-0.27
+0.27
tCK
DQS, /DQS falling edge setup time to
CK, /CK rising edge
tDSS
0.18
-
tCK
DQS, /DQS falling edge hold time to
CK, /CK rising edge
tDSH
0.18
-
tCK
Delay from start of Internal write
transaction to Internal read command
tWTR
Max
(4tck, 7.5ns)
-
Write recovery time
tWR
15
-
ns
Mode register set command cycle
time
tMRD
4
-
tCK
/CAS to /CAS command delay
tCCD
4
-
nCK
Auto precharge write recovery +
precharge time
tDAL
tWR+tRP/tck
nCK
240Pin DDR3L 1600 UDIMM
2GB Based on 256Mx8
AQD-D3L2GN16-SQ
9
Active to active command period for
1KB page size
tRRD
Max
(4tck, 6ns)
-
ns
Speed
DDR3 1600
Unit
Parameter
Symbol
Min
Max
Active to active command period for
2KB page size
tRRD
Max
(4tck, 7.5ns)
-
Four Activate Window for 1KB page
size
tFAW
30
-
ns
Four Activate Window for 2KB page
size products
tFAW
40
-
ns
Power-up and RESET calibration time
tZQinitl
512
-
tCK
Normal operation Full calibration time
tZQoper
256
-
tCK
Normal operation short calibration
time
tZQcs
64
-
tCK
Exit self refresh to commands not
requiring a locked DLL
tXS
Max
(5tCK, tRFC+10ns)
-
Exit self refresh to commands
requiring a locked DLL
tXSDLL
tDLL(min)
-
tCK
Internal read to precharge command
delay
tRTP
Max
(4tck, 7.5ns)
-
Minimum CKE low width for Self
refresh entry to exit timing
tCKESR
tCK(min)+1tCK
-
Exit power down with DLL to any valid
command: Exit Precharge Power
Down with DLL
tXP
Max
(3tCK, 6ns)
-
CKE minimum pulse width (high and
low pulse width)
tCKE
Max
(3tCK, 5ns)
Asynchronous RTT turn-on delay
(Power-Down mode)
tAONPD
2
8.5
ns
Asynchronous RTT turn-off delay
(Power-Down mode)
tAOFPD
2
8.5
ns
ODT turn-on
tAON
-225
225
ps
ODT turn-off
tAOF
0.3
0.7
tCK

AQD-D3L2GN16-SQ

Mfr. #:
Manufacturer:
Advantech
Description:
Memory Modules 2G DDR3-1600 256X8 1.35V SAM(G)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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