TDA3683_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 7 October 2005 28 of 31
Philips Semiconductors
TDA3683
Multiple voltage regulator with switch and ignition buffer
13. Soldering
13.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
13.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
13.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
13.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
Table 9: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
TDA3683_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 7 October 2005 29 of 31
Philips Semiconductors
TDA3683
Multiple voltage regulator with switch and ignition buffer
14. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
TDA3683_2 20051007 Product data sheet - - TDA3683J_1
Modifications:
Replaced through the document TDA3683J with TDA3683
Section 4 “Ordering information”: Added TDA3683SD (SOT889-1 package)
Section 7.5 “Storage capacitor”: Added last paragraph
Section 10 “Characteristics”
Added on page 15 two values to I
q(tot)
Changed on page 16 symbols V
th(r)(RST1)
and V
th(f)(RST1)
to V
th(r)(RDC1)
and V
th(f)(RDC1)
with
adapted parameter description
Added on page 16 parameters V
OH(RST1)
and V
OL(RST1)
Changed on page 17 symbols V
th(r)(RST2/3)
and V
th(f)(RST2/3)
to V
th(r)(RDC2/3)
and V
th(f)(RDC2/3)
with adapted parameter description
Added on page 17 parameters V
OH(RST2/3)
and V
OL(RST2/3)
Changed on page 18 to 20 the values of I
m(REG1)
to I
m(REG7)
and I
DC(PSW)
Figure 9: Added a figure note with component specifications
Section 12 “Package outline”: Added SOT889-1 drawing
TDA3683J_1 20041213 Preliminary data sheet - 9397 750 13057 -
Philips Semiconductors
TDA3683
Multiple voltage regulator with switch and ignition buffer
TDA3683_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 7 October 2005 30 of 31
15. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
17. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
18. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status
[1]
Product status
[2] [3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

TDA3683J/N2S,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Linear Voltage Regulators MULT VLTG REGULATOR SWITCH/IGNITION BUFF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union