NB4N121K
http://onsemi.com
9
PACKAGE DIMENSIONS
QFN52 8x8, 0.5P
CASE 485M−01
ISSUE C
C0.15
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.08
A1
A3
A
D2
L
NOTE 3
C0.15
2X
2X
SEATING PLANE
C0.10
A2
C
E2
52 X
e
1
13
14 26
27
39
4052
b
52 X
A0.10 BC
0.05 C
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A2 0.60 0.80
A3 0.20 REF
b 0.18 0.30
D 8.00 BSC
D2 6.50 6.80
E 8.00 BSC
E2 6.50 6.80
e 0.50 BSC
K 0.20 ---
REF
K
52 X
L 0.30 0.50
PIN ONE
REFERENCE
SOLDERING FOOTPRINT*
DIMENSIONS: MILLIMETERS
8.30
6.75
6.75
0.50
0.62
0.30
52X
52X
PITCH
8.30
PKG
OUTLINE
RECOMMENDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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