ADG733BRUZ-REEL7

REV. B
ADG733/ADG734
–10–
*
IN1–4 FOR ADG734
GND
V
DD
ADG733/
ADG734
V
OUT
C
L
1nF
V
S
R
S
D
S
V
DD
V
SS
V
SS
V
IN
EN
*
V
OUT
3V
V
OUT
LOGIC
INPUT (V
IN
)
Q
INJ
= C
L
V
OUT
0V
Test Circuit 7. Charge Injection
V
S
V
OUT
50
NETWORK
ANALYZER
R
L
50
IN
GND
V
IN
S
D
50
OFF ISOLATION = 20 LOG
V
OUT
V
S
V
DD
0.1F
V
DD
V
SS
0.1F
V
SS
Test Circuit 8. Off Isolation
CHANNEL-TO-CHANNEL
CROSSTALK = 20
LOG
GND
V
DD
0.1F
V
DD
V
SS
0.1F
V
SS
SA
D
SB
V
S
V
OUT
NETWORK
ANALYZER
R
L
50
IN
V
OUT
V
S
50
R
50
Test Circuit 9. Channel-to-Channel Crosstalk
V
S
V
OUT
50
NETWORK
ANALYZER
R
L
50
IN
GND
V
IN
S
D
INSERTION
LOSS
=
20
LOG
V
OUT
WITH
SWITCH
V
OUT
WITHOUT
SWITCH
V
DD
0.1F
V
DD
V
SS
0.1F
V
SS
Test Circuit 10. Bandwidth
Data Sheet ADG733/ADG734
OUTLINE DIMENSIONS
Fig
ure 11. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
Fig
ure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
01-28-2008-A
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.7
5
0.60
0.4
5
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
--11--
REV. B
ADG733/ADG734 Data Sheet
Fig
ure 13. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG733BRQZ −40°C to +85°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG733BRQZ-REEL −40°C to +85°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG733BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG733BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG733BRUZ-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG733BRUZ-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG734BRU −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRU-REEL −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRUZ −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRUZ-REEL −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRUZ-REEL7 −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
1
Z = RoHS Compliant Part.
REVISION HISTORY
4/14—Rev. A to Rev. B
Updated Outline Dimensions ....................................................... 11
Changes to Ordering Guide .......................................................... 12
11/02—Data Sheet changed from REV. 0 to REV. A.
Changes to FEATURES ................................................................... 1
Changes to PRODUCT HIGHLIGHTS ........................................ 1
Changes to SPECIFICATIONS ...................................................... 2
Changes to ABSOLUTE MAXIMUM RATINGS Note 2 ........... 5
Changes to TERMINOLOGY table ............................................... 6
Replaced TPCs 2, 5, 8, and 9 ........................................................... 7
Edits to TPCs 6 and 7 ....................................................................... 7
Replaced TPC 12............................................................................... 8
Edits to TPCs 13 and 16 ................................................................... 8
Replaced Test Circuits 8 and 9 ...................................................... 10
Added Test Circuit 10 .................................................................... 10
Updated OUTLINE DIMENSIONS ............................................ 11
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
COPLANARIT
0.10
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D01602-0-4/14(B)
--12--
REV. B

ADG733BRUZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs 72dB 2.5 Ohm 160MHz CMOS Triple SPDT
Lifecycle:
New from this manufacturer.
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