ADG733/ADG734 Data Sheet
Fig
ure 13. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG733BRQZ −40°C to +85°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG733BRQZ-REEL −40°C to +85°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG733BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG733BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG733BRUZ-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG733BRUZ-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG734BRU −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRU-REEL −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRUZ −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRUZ-REEL −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG734BRUZ-REEL7 −40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
1
Z = RoHS Compliant Part.
REVISION HISTORY
4/14—Rev. A to Rev. B
Updated Outline Dimensions ....................................................... 11
Changes to Ordering Guide .......................................................... 12
11/02—Data Sheet changed from REV. 0 to REV. A.
Changes to FEATURES ................................................................... 1
Changes to PRODUCT HIGHLIGHTS ........................................ 1
Changes to SPECIFICATIONS ...................................................... 2
Changes to ABSOLUTE MAXIMUM RATINGS Note 2 ........... 5
Changes to TERMINOLOGY table ............................................... 6
Replaced TPCs 2, 5, 8, and 9 ........................................................... 7
Edits to TPCs 6 and 7 ....................................................................... 7
Replaced TPC 12............................................................................... 8
Edits to TPCs 13 and 16 ................................................................... 8
Replaced Test Circuits 8 and 9 ...................................................... 10
Added Test Circuit 10 .................................................................... 10
Updated OUTLINE DIMENSIONS ............................................ 11
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
COPLANARIT
0.10
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D01602-0-4/14(B)
--12--
REV. B