Data Sheet HMC8500
Rev. 0 | Page 15 of 16
EVALUATION BOARD
The HMC8500 evaluation board is a 2-layer board fabricated
using Rogers 4350 and using best practices for high frequency
RF design. The RF input and RF output traces have a 50 Ω
characteristic impedance. The board is attached to a heat sink
using an electrically and thermally conductive epoxy providing
a low thermal and low dc resistance path. Components are
mounted using SN63 solder allowing rework of the surface-
mount components without compromising the circuit board to
heat sink attachment.
The evaluation board and populated components are designed
to operate over the ambient temperature range of −40°C to +85°C.
During operation, attach the evaluation board to a temperature
controlled plate to control the temperature of the HMC8500
during operation. For the proper bias sequence, see the
Applications Information section.
A fully populated and tested evaluation board, shown in Figure 42,
is available from Analog Devices, Inc., upon request.
Figure 42. Evaluation PCB
Table 8. Bill of Materials for Evaluation PCB EV1HMC8500LP5D
Item Description Manufacturer/Part Number
J2, J3 K connector SRI/25-146-1000-92
J1 Preform surface terminal strip SAMTEC/TSM-113-01-L-DV
J4 Surface-mount jumper Components corporation/SJ-1206-01-T
C1 0.8 pF capacitor, 0402 package Murata/GRM1555C1HR80BA01D
C2, C3, C4, C5 2.2 nF capacitors, 0603 package TDK/C1608C0G1H222J
C6, C7, C9, C10 10 μF capacitors, 1210-2 package TDK/ C3225X7S1H106K250AB
C8 2 pF capacitor, 0603 package Murata/GQM1875C2E2R0BB12
C11 10 pF capacitor, 0402 package Phycomp (Yageo)/CC0402JRNP09BN100
L1 1.2 nH inductor, 0402 package Panasonic/ ELJ-RF1N2DF
L2 910 nH inductor, 1008CS package Coilcraft/1008CS-911XGLB
L4 3.6 nH inductor, 0603 package Coilcraft/0603CS-3N6XGLU
R1 25 Ω high precision resistor, 0603package Vishay/P0603E25R0BNT
R2 10 Ω resistor, 0402 package Panasonic/ERJ-2RKF10R0X
Heat sink Used for thermal transfer from the HMC8500 amplifier Not applicable
U1 Amplifier Analog Devices/HMC8500
PCB EV1HMC8500LP5D Circuit board material: Rogers 4350 Analog Devices/EV1HMC8500LP5D
14694-042
HMC8500 Data Sheet
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
Fig
ure 43. 32-Lead Lead Frame Chip Scale Package, Premolded Cavity [LFCSP_CAV]
5 mm × 5 mm Body and 1.34 mm Package Height
(CG-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature MSL Rating
3
Description
4
Package Option Branding
5
HMC8500LP5DE −40°C to +85°C MSL3 32-Lead LFCSP_CAV CG-32-1
XXXX
H8500
HMC8500LP5DETR 40°C to +85°C MSL3 32-Lead LFCSP_CAV CG-32-1
XXXX
H8500
EV1HMC8500LP5D Evaluation PCB
1
The HMC8500LP5DE and the HMC8500LP5DETR are LFCSP premolded copper alloy lead frame and RoHS compliant.
2
When ordering the evaluation board only, reference the model number, EV1HMC8500LP5D.
3
See the Absolute Maximum Ratings section for additional information.
4
The lead finish of the HMC8500LP5DE and the HMC8500LP5DETR is nickel palladium gold (NiPdAu).
5
The 4-digit lot number for the HMC8500LP5DE and the HMC8500LP5DETR is represented by XXXX.
03-30-2016-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
SIDE VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
SEATING
PLANE
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
1.53
1.35
1.15
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.55
0.50
0.35
0.50 MIN
3.15
3.00 SQ
2.85
PKG-004844
3.50 REF
6° BSC
4.81 REF
SQ
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14694-0-1/17(0)

HMC8500LP5DE

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Amplifier High Power GaN Amps 10W 1-2.5GHz PA
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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