Data Sheet HMC8500
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
1
Rating
Drain Bias Voltage (V
DD
) 35 V dc
Gate Bias Voltage (V
GG
) −8 V to 0 V dc
Radio Frequency (RF) Input Power (RFIN) 33 dBm
Maximum Voltage Standing Wave Ratio
(VSWR)
2
6:1
Channel Temperature 225°C
Maximum Peak Reflow Temperature (MSL3)
3
260°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C,
Derate 108.6 mW/°C Above 85°C)
12.5 W
Storage Temperature Range −40°C to +125°C
Operating Temperature Range −40°C to +85°C
ESD Sensitivity (Human Body Model) Class 1B, passed
500 V
1
When referring to a single function of a multifunction pin in the parameters,
only the portion of the pin name that is relevant to the Absolute Maximum
Rating is listed. For full pin names of multifunction pins, refer to the Pin
Configuration and Function Descriptions section.
2
Restricted by maximum power dissipation.
3
See the Ordering Guide for additional information.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JC
is the junction to case thermal resistance.
Table 6. Thermal Resistance
Package Type θ
JC
Unit
CG-32-1
1
9.2 °C/W
1
Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board with 36 thermal vias. See JEDEC JESD51.
ESD CAUTION
