HMC8500 Data Sheet
Rev. 0 | Page 6 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 7. Pad Function Descriptions
Pin No. Mnemonic Description
1, 8, 9, 16, 17, 24, 25, 32 GND Ground. These pins must be connected to RF/dc ground. See Figure 3 for the GND interface schematic.
2, 3, 6, 7, 10 to 15, 18,
19, 22, 23, 26 to 31
NIC No Internal Connection. These pins are not connected internally. However, all data was measured
with these pins connected to RF/dc ground externally.
4, 5 RFIN/V
GG
RF Input/Gate Bias Control Voltage. This pin is a multifunction pin. The RFIN/V
GG
pin is dc-coupled
with internal prematching and requires external matching to 50 Ω, as shown in Figure 41. See
Figure 4 for the RFIN/V
GG
interface schematic.
20, 21 RFOUT/V
DD
RF Output/Drain Bias Voltage. This is a multifunction pin. The RFOUT/V
DD
pin is dc-coupled and requires
external matching to 50 Ω, as shown in Figure 41. See Figure 4 for the RFOUT/V
DD
interface schematic.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
Figure 3. GND Interface Schematic
Figure 4. RFIN/V
GG
and RFOUT/V
DD
Interface Schematic
NOTES
1. NO INTERNAL CONNECTION. THESE PINS ARE NOT
CONNECTED INTERNALLY. HOWEVER, ALL DATA
WAS MEASURED WITH THESE PINS CONNECTED
TO RF/DC GROUND EXTERNALLY.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
HMC8500
TOP VIEW
(Not to Scale)
17
1
3
4
2
9
GND
NIC
NIC
RFIN/V
GG
5
6
RFIN/V
GG
NIC
7
NIC
8
GND
GND
18
NIC
19
NIC
20
RFOUT/V
DD
21
RFOUT/V
DD
22
NIC
23
NIC
24
GND
GND
12
NIC
11
NIC
10
NIC
13
NIC
14
NIC
15
NIC
16
GND
25
GND
26
NIC
27
NIC
28
NIC
29
NIC
30
NIC
31
NIC
32
GND
PACKAGE
BASE
14694-002
14694-003
RFOUT/V
DD
RFIN/V
GG
14694-004
