BF513,215

DATA SHEET
Product specification December 1997
DISCRETE SEMICONDUCTORS
BF510 to 513
N-channel silicon field-effect
transistors
December 1997 2
NXP Semiconductors Product specification
N-channel silicon field-effect transistors BF510 to 513
DESCRIPTION
Asymmetrical N-channel planar
epitaxial junction field-effect
transistors in the miniature plastic
envelope intended for applications up
to the v.h.f. range in hybrid thick and
thin-film circuits. Special features are
the low feedback capacitance and the
low noise figure. These features
make the product very suitable for
applications such as the r.f. stages in
f.m. portables (BF510), car radios
(BF511) and mains radios (BF512) or
the mixer stage (BF513).
PINNING - SOT23
1=gate
2 = drain
3 = source
MARKING CODE
BF510 = S6p
BF511 = S7p
BF512 = S8p
BF513 = S9p
Fig.1 Simplified outline and symbol.
handbook, halfpage
12
g
d
s
3
Top view
MAM385
QUICK REFERENCE DATA
Drain-source voltage V
DS
max. 20 V
Drain current (DC or average) I
D
max. 30 mA
Total power dissipation
up to T
amb
=40 CP
tot
max. 250 mW
BF510 511 512 513
Drain current 0.7 2.5 6 10 mA
V
DS
=10 V; V
GS
= 0 I
DSS
3.0 7.0 12 18 mA
Transfer admittance (common source)
V
DS
=10 V; V
GS
=0; f = 1 kHz y
fs
 2.5467mS
Feedback capacitance
V
DS
= 10 V; V
GS
=0 C
rs
typ. 0.3 0.3 pF
V
DS
= 10 V; I
D
=5 mA C
rs
typ. 0.3 0.3 pF
Noise figure at optimum source admittance
G
S
=1 mS; B
S
= 3 mS; f = 100 MHz
V
DS
=10 V; V
GS
=0 F typ. 1.5 1.5 dB
V
DS
=10 V; I
D
=5 mA F typ. 1.5 1.5 dB
December 1997 3
NXP Semiconductors Product specification
N-channel silicon field-effect transistors BF510 to 513
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
Note
1. Mounted on a ceramic substrate of 8 mm 10 mm 0.7 mm.
STATIC CHARACTERISTICS
T
amb
= 25 C
Drain-source voltage V
DS
max. 20 V
Drain-gate voltage (open source) V
DGO
max. 20 V
Drain current (DC or average) I
D
max. 30 mA
Gate current I
G
max. 10 mA
Total power dissipation up to T
amb
=40 C (note 1) P
tot
max. 250 mW
Storage temperature range T
stg
65 to 150 C
Junction temperature T
j
max. 150 C
From junction to ambient (note 1) R
th j-a
= 430 K/W
BF510 511 512 513
Gate cut-off current
V
GS
= 0.2 V; V
DS
=0 I
GSS
10 10 10 10 nA
Gate-drain breakdown voltage
I
S
=0; I
D
=10 A V
(BR)GDO
20 20 20 20 V
Drain current
<
0.7
3.0
2.5
7.0
6
12
10
18
mA
mA
V
DS
=10 V; V
GS
=0 I
DSS
Gate-source cut-off voltage
I
D
=10A; V
DS
=10 V V
(P)GS
typ. 0.8 1.5 2.2 3 V

BF513,215

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RF JFET Transistors TAPE7 FET-RFSS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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