4
IDT72801/728211/72821/72831/72841/72851 DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
MARCH 2013
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage
(Com'l & Ind'l) 4.5 5.0 5.5 V
GND Supply Voltage
(Com'l & Ind'l) 0 0 0 V
VIH Input High Voltage
(Com'l & Ind'l) 2.0 V
VIL Input Low Voltage
(Com'l & Ind'l) 0.8 V
TA Operating Temperature 0 70 °C
Commercial
TA Operating Temperature –40 85 °C
Industrial
Symbol Rating Com'l & Ind'l Unit
VTERM Terminal Voltage with –0.5 to +7.0 V
Respect to GND
TSTG StorageTemperature –55 to +125 °C
IOUT DC Output Current –50 to +50 mA
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of the specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C)
IDT72801
IDT72811
IDT72821
IDT72831
IDT72841 IDT72851
Commercial and Industrial
(1)
Commercial and Industrial
(1)
tCLK = 10, 15, 25 ns tCLK = 10, 15, 25 ns
Symbol Parameter Min. Typ. Max. Min. Typ. Max. Unit
ILI
(2)
Input Leakage Current (Any Input) 1 1 1 1 μA
I
LO
(3)
Output Leakage Current 10 10 10 10 μA
V
OH Output Logic “1” Voltage, IOH = –2 mA 2.4 2.4 V
V
OL Output Logic “0” Voltage, IOL = 8 mA 0.4 0.4 V
I
CC1
(4,5,6,8)
Active Power Supply Current (both FIFOs) 60 80 mA
I
CC2
(
4,7,8
)
Standby Current 10 10 mA
Symbol Parameter Conditions Max. Unit
C
IN
(2)
Input Capacitance VIN = 0V 10 pF
C
OUT
(1,2)
Output Capacitance VOUT = 0V 10 pF
RECOMMENDED OPERATING CONDITIONS
NOTES:
1. Industrial temperature range product for 15ns and 25ns speed grade are available as a standard device.
2. Measurements with 0.4 VIN VCC.
3. OE VIH, 0.4 VOUT VCC.
4. Tested with outputs open (IOUT = 0).
5. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz.
6. Typical ICC1 = 2*[1.7 + 0.7*fS + 0.02*CL*fS] (in mA).
These equations are valid under the following conditions:
VCC = 5V, TA = 25
°°
°°
°C, fS = WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2, CL = capacitive load (in pF).
7. All Inputs = VCC - 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.
8. ICC1 and ICC2 parameters are improved as compared to previous data sheets.
CAPACITANCE (TA = +25°C, f = 1.0MHz)
NOTE:
1. With output deselected (OEA, OEB
VIH).
2. Characterized values, not currently tested.
5
IDT72801/728211/72821/72831/72841/72851 DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
MARCH 2013
Com'l &
Commercial Ind'l
(1)
IDT72801L10 IDT72801L15 IDT72801L25
IDT72811L10 IDT72811L15 IDT72811L25
IDT72821L10 IDT72821L15 IDT72821L25
IDT72831L10 IDT72831L15 IDT72831L25
IDT72841L10 IDT72841L15 IDT72841L25
IDT72851L10 IDT72851L15 IDT72851L25
Symbol Parameter Min Max. Min Max. Min Max. Unit
fS Clock Cycle Frequency 100 66.7 40 MHz
tA Data Access Time 2 6.5 2 10 2 15 ns
tCLK Clock Cycle Time 10 15 25 ns
tCLKH Clock High Time 4.5 6 10 ns
tCLKL Clock Low Time 4.5 6 10 ns
tDS Data Setup Time 3 4 6 ns
tDH Data Hold Time 0.5 1 1 ns
tENS Enable Setup Time 3 4 6 ns
tENH Enable Hold Time 0.5 1 1 ns
tRS Reset Pulse Width
(2)
10 15 15 ns
tRSS Reset Setup Time 8 10 15 ns
tRSR Reset Recovery Time 8 10 15 ns
tRSF Reset to Flag Time and Output Time 10 15 25 ns
tOLZ Output Enable to Output in Low-Z
(3)
0—00— ns
tOE Output Enable to Output Valid 3 6 3 8 3 13 ns
tOHZ Output Enable to Output in High-Z
(3)
3 6 3 8 3 13 ns
tWFF Write Clock to Full Flag 6.5 10 15 ns
tREF Read Clock to Empty Flag 6.5 10 15 ns
tPAF Write Clock to Programmable 6.5 10 15 ns
Almost-Full Flag
tPAE Read Clock to Programmable 6.5 10 15 ns
Almost-Empty Flag
tSKEW1 Skew Time Between Read Clock and 5 6 10 ns
Write Clock for Empty Flag and Full Flag
tSKEW2 Skew Time Between Read Clock and Write 14 15 18 ns
Clock for Programmable Almost-Empty Flag
and Programmable Almost-Full Flag
In Pulse Levels GND to 3.0V
Input Rise/Fall Times 3ns
Input Timing Reference Levels 1.5V
Output Reference Levels 1.5V
Output Load See Figure 1
or equivalent circuit
Figure 1. Output Load
*Includes jig and scope capacitances.
30pF*
1.1K
5V
680Ω
D.U.T.
3034 drw 03
AC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C)
NOTES:
1. Industrial temperature range product for 15ns and 25ns speed grade are available as a standard device.
2. Pulse widths less than minimum values are not allowed.
3. Values guaranteed by design, not currently tested.
AC TEST CONDITIONS
6
IDT72801/728211/72821/72831/72841/72851 DUAL CMOS SyncFIFO
TM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
MARCH 2013
When either of the two Read Enable RENA1, RENA2 (RENB1, RENB2)
associated with FIFO A (B) is HIGH, the output register holds the previous data
and no new data is allowed to be loaded into the register.
When all the data has been read from FIFO A (B), the Empty Flag EFA ( EFB)
will go LOW, inhibiting further read operations. Once a valid write operation has
been accomplished, EFA (EFB) will go HIGH after tREF and a valid read can
begin. The Read Enables RENA1, RENA2 (RENB1, RENB2) are ignored when
FIFO A (B) is empty.
Output Enable (OEA, OEB) — When Output Enable OEA ( OEB) is enabled
(LOW), the parallel output buffers of FIFO A (B) receive data from their respective
output register. When Output Enable OEA ( OEB) is disabled (HIGH), the QA
(QB) output data bus is in a high-impedance state.
Write Enable 2/Load (WENA2/LDA, WENB2/LDB) — This is a dual-
purpose pin. FIFO A (B) is configured at Reset to have programmable flags
or to have two write enables, which allows depth expansion. If WENA2/LDA
(WENB2/LDB) is set HIGH at Reset RSA = LOW (RSB = LOW), this pin operates
as a second write enable pin.
If FIFO A (B) is configured to have two write enables, when Write Enable
1 WENA1 ( WENB1) is LOW and WENA2/LDA (WENB2/LDB) is HIGH, data can be
loaded into the input register and RAM array on the LOW-to-HIGH transition
of every Write Clock WCLKA (WCLKB). Data is stored in the array sequentially
and independently of any ongoing read operation.
In this configuration, when WENA1 ( WENB1) is HIGH and/or WENA2/LDA
(WENB2/LDB) is LOW, the input register of Array A holds the previous data and
no new data is allowed to be loaded into the register.
To prevent data overflow, the Full Flag FFA (FFB) will go LOW, inhibiting
further write operations. Upon the completion of a valid read cycle, FFA ( FFB)
will go HIGH after tWFF, allowing a valid write to begin. WENA1, (WENB1) and
WENA2/LDA (WENB2/LDB) are ignored when the FIFO is full.
FIFO A (B) is configured to have programmable flags when the WENA2/
LDA (WENB2/LDB) is set LOW at Reset RSA = LOW (RSB = LOW). Each FIFO
contains four 8-bit offset registers which can be loaded with data on the inputs,
or read on the outputs. See Figure 3 for details of the size of the registers and
the default values.
If FIFO A (B) is configured to have programmable flags, when the WENA1
(WENB1) and WENA2/LDA (WENB2/LDB) are set LOW, data on the DA (DB)
inputs are written into the Empty (Least Significant Bit) Offset register on the first
LOW-to-HIGH transition of the WCLKA (WCLKB). Data are written into the
Empty (Most Significant Bit) Offset register on the second LOW-to-HIGH
transition of WCLKA (WCLKB), into the Full (Least Significant Bit) Offset register
on the third transition, and into the Full (Most Significant Bit) Offset register on
the fourth transition. The fifth transition of WCLKA (WCLKB) again writes to the
Empty (Least Significant Bit) Offset register.
However, writing all offset registers does not have to occur at one time. One
or two offset registers can be written and then by bringing LDA ( LDB) HIGH, FIFO
A (B) is returned to normal read/write operation. When LDA (LDB) is set LOW,
and WENA1 ( WENB1) is LOW, the next offset register in sequence is written.
The contents of the offset registers can be read on the QA (QB) outputs when
WENA2/LDA (WENB2/LDB) is set LOW and both Read Enables RENA1, RENA2
(RENB1, RENB2) are set LOW. Data can be read on the LOW-to-HIGH transition
of the Read Clock RCLKA (RCLKB).
SIGNAL DESCRIPTIONS
FIFO A and FIFO B are identical in every respect. The following description
explains the interaction of input and output signals for FIFO A. The correspond-
ing signal names for FIFO B are provided in parentheses.
INPUTS:
Data In (DA0 – DA8, DB0 – DB8)
DA0 - DA8 are the nine data inputs
for memory array A. DB0 - DB8 are the nine data inputs for memory array B.
CONTROLS:
Reset ( RSA, RSB) Reset of FIFO A (B) is accomplished whenever RSA
(RSB) input is taken to a LOW state. During Reset, the internal read and write
pointers associated with the FIFO are set to the first location. A Reset is required
after power-up before a write operation can take place. The Full Flag FFA ( FFB)
and Programmable Almost-Full flag PAFA (PAFB) will be reset to HIGH after
tRSF. The Empty Flag EFA ( EFB) and Programmable Almost-Empty flag PAEA
(PAEB) will be reset to LOW after tRSF. During Reset, the output register is
initialized to all zeros and the offset registers are initialized to their default values.
Write Clock (WCLKA, WCLKB) A write cycle to Array A (B) is
initiated on the LOW-to-HIGH transition of WCLKA (WCLKB). Data setup
and hold times must be met with respect to the LOW-to-HIGH transition of
WCLKA (WCLKB). The Full Flag FFA (FFB) and Programmable Almost-Full
flag PAFA ( PAFB) are synchronized with respect to the LOW-to-HIGH transition
of the Write Clock WCLKA (WCLKB).
The Write and Read Clocks can be asynchronous or coincident.
Write Enable 1 (WENA1, WENB1)
If FIFO A (B) is configured for
programmable flags, WENA1 (WENB1) is the only enable control pin. In this
configuration, when WENA1 ( WENB1) is LOW, data can be loaded into the input
register of RAM Array A (B) on the LOW-to-HIGH transition of every Write Clock
WCLKA (WCLKB). Data is stored in Array A (B) sequentially and independently
of any ongoing read operation.
In this configuration, when WENA1 ( WENB1) is HIGH, the input register holds
the previous data and no new data is allowed to be loaded into the register.
If the FIFO is configured to have two write enables, which allows for depth
expansion. See Write Enable 2 paragraph below for operation in this
configuration.
To prevent data overflow, FFA (FFB) will go LOW, inhibiting further write
operations. Upon the completion of a valid read cycle, the FFA ( FFB) will go HIGH
after t
WFF
, allowing a valid write to begin. WENA1 ( WENB1) is ignored when FIFO
A (B) is full.
Read Clock (RCLKA, RCLKB) — Data can be read from Array A (B) on
the LOW-to-HIGH transition of RCLKA (RCLKB). The Empty Flag EFA ( EFB)
and Programmable Almost-Empty Flag PAEA ( PAEB) are synchronized with
respect to the LOW-to-HIGH transition of RCLKA (RCLKB).
The Write and Read Clocks can be asynchronous or coincident.
Read Enables (RENA1, RENA2, RENB1, RENB2) — When both Read
Enables RENA1, RENA2 (RENB1, RENB2) are LOW, data is read from Array
A (B) to the output register on the LOW-to-HIGH transition of the Read Clock
RCLKA (RCLKB).

72831L10PFG

Mfr. #:
Manufacturer:
IDT
Description:
FIFO DUAL 2K X 9
Lifecycle:
New from this manufacturer.
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