MAX8792
Single Quick-PWM Step-Down
Controller with Dynamic REFIN
______________________________________________________________________________________ 19
Adaptive dead-time circuits monitor the DL and DH dri-
vers and prevent either FET from turning on until the
other is fully off. The adaptive driver dead time allows
operation without shoot-through with a wide range of
MOSFETs, minimizing delays and maintaining efficiency.
There must be a low-resistance, low-inductance path
from the DL and DH drivers to the MOSFET gates for
the adaptive dead-time circuits to work properly; other-
wise, the sense circuitry in the MAX8792 interprets the
MOSFET gates as “off” while charge actually remains.
Use very short, wide traces (50 mils to 100 mils wide if
the MOSFET is 1in from the driver).
The internal pulldown transistor that drives DL low is
robust, with a 0.9Ω (typ) on-resistance. This helps pre-
vent DL from being pulled up due to capacitive coupling
from the drain to the gate of the low-side MOSFETs
when the inductor node (LX) quickly switches from
ground to V
IN
. Applications with high-input voltages and
long inductive driver traces may require rising LX edges
do not pull up the low-side MOSFETs’ gate, causing
shoot-through currents. The capacitive coupling
between LX and DL created by the MOSFET’s gate-to-
drain capacitance (C
RSS
), gate-to-source capacitance
(C
ISS
- C
RSS
), and additional board parasitics should
not exceed the following minimum threshold:
Typically, adding a 4700pF between DL and power
ground (C
NL
in Figure 6), close to the low-side
MOSFETs, greatly reduces coupling. Do not exceed
22nF of total gate capacitance to prevent excessive
turn-off delays.
Alternatively, shoot-through currents can be caused by
a combination of fast high-side MOSFETs and slow low-
side MOSFETs. If the turn-off delay time of the low-side
MOSFET is too long, the high-side MOSFETs can turn
on before the low-side MOSFETs have actually turned
off. Adding a resistor less than 5Ω in series with BST
slows down the high-side MOSFET turn-on time, elimi-
nating the shoot-through currents without degrading
the turn-off time (R
BST
in Figure 6). Slowing down the
high-side MOSFET also reduces the LX node rise time,
thereby reducing EMI and high-frequency coupling
responsible for switching noise.
Quick-PWM Design Procedure
Firmly establish the input voltage range and maximum
load current before choosing a switching frequency and
inductor operating point (ripple-current ratio). The prima-
ry design trade-off lies in choosing a good switching fre-
quency and inductor operating point, and the following
four factors dictate the rest of the design:
Input voltage range: The maximum value
(V
IN(MAX)
) must accommodate the worst-case input
supply voltage allowed by the notebook’s AC
adapter voltage. The minimum value (V
IN(MIN)
)
must account for the lowest input voltage after
drops due to connectors, fuses, and battery selec-
tor switches. If there is a choice at all, lower input
voltages result in better efficiency.
Maximum load current: There are two values to
consider. The peak load current (I
LOAD(MAX)
)
determines the instantaneous component stresses
and filtering requirements, and thus drives output
VV
C
C
GS TH IN
RSS
ISS
()
>
BST
DH
LX
(R
BST
)*
INPUT (V
IN
)
C
BST
C
BYP
L
(R
BST
)* OPTIONAL—THE RESISTOR LOWERS EMI BY DECREASING
THE SWITCHING NODE RISE TIME.
(C
NL
)* OPTIONAL—THE CAPACITOR REDUCES LX TO DL CAPACITIVE
COUPLING THAT CAN CAUSE SHOOT-THROUGH CURRENTS.
DL
PGND
N
L
N
H
(C
NL
)*
V
DD
Figure 6. Gate Drive Circuit
MAX8792
Single Quick-PWM Step-Down
Controller with Dynamic REFIN
20 ______________________________________________________________________________________
capacitor selection, inductor saturation rating, and
the design of the current-limit circuit. The continu-
ous load current (I
LOAD
) determines the thermal
stresses and thus drives the selection of input
capacitors, MOSFETs, and other critical heat-con-
tributing components. Most notebook loads gener-
ally exhibit I
LOAD
= I
LOAD(MAX)
x 80%.
Switching frequency: This choice determines the
basic trade-off between size and efficiency. The
optimal frequency is largely a function of maximum
input voltage due to MOSFET switching losses that
are proportional to frequency and V
IN
2
. The opti-
mum frequency is also a moving target, due to
rapid improvements in MOSFET technology that are
making higher frequencies more practical.
Inductor operating point: This choice provides
trade-offs between size vs. efficiency and transient
response vs. output noise. Low inductor values pro-
vide better transient response and smaller physical
size, but also result in lower efficiency and higher
output noise due to increased ripple current. The
minimum practical inductor value is one that causes
the circuit to operate at the edge of critical conduc-
tion (where the inductor current just touches zero
with every cycle at maximum load). Inductor values
lower than this grant no further size-reduction bene-
fit. The optimum operating point is usually found
between 20% and 50% ripple current.
Inductor Selection
The switching frequency and operating point (% ripple
current or LIR) determine the inductor value as follows:
Find a low-loss inductor having the lowest possible DC
resistance that fits in the allotted dimensions. Ferrite
cores are often the best choice, although powdered
iron is inexpensive and can work well at 200kHz. The
core must be large enough not to saturate at the peak
inductor current (I
PEAK
):
Transient Response
The inductor ripple current impacts transient-response
performance, especially at low V
IN
- V
OUT
differentials.
Low inductor values allow the inductor current to slew
faster, replenishing charge removed from the output fil-
ter capacitors by a sudden load step. The amount of
output sag is also a function of the maximum duty factor,
which can be calculated from the on-time and minimum
off-time. The worst-case output sag voltage can be
determined by:
where t
OFF(MIN)
is the minimum off-time (see the
Electrical
Characteristics
table).
The amount of overshoot due to stored inductor energy
when the load is removed can be calculated as:
Setting the Valley Current Limit
The minimum current-limit threshold must be high
enough to support the maximum load current when the
current limit is at the minimum tolerance value. The val-
ley of the inductor current occurs at I
LOAD(MAX)
minus
half the inductor ripple current (ΔIL); therefore:
where I
LIMIT(LOW)
equals the minimum current-limit
threshold voltage divided by the low-side MOSFETs on-
resistance (R
DS(ON)
).
The valley current-limit threshold is precisely 1/20 the
voltage seen at ILIM. Connect a resistive divider from
REF to ILIM to analog ground (GND) in order to set a
fixed valley current-limit threshold. The external 400mV to
2V adjustment range corresponds to a 20mV to 100mV
valley current-limit threshold. When adjusting the current-
limit threshold, use 1% tolerance resistors and a divider
current of approximately 5μA to 10μA to prevent signifi-
cant inaccuracy in the valley current-limit tolerance.
The MAX8792 uses the low-side MOSFET’s on-resis-
tance as the current-sense element (R
SENSE
=
R
DS(ON)
). Therefore, special attention must be made to
the tolerance and thermal variation of the on-resistance.
Use the worst-case maximum value for R
DS(ON)
from
the MOSFET data sheet, and add some margin for the
rise in R
DS(ON)
with temperature. A good general rule is
to allow 0.5% additional resistance for each °C of tem-
perature rise, which must be included in the design
margin unless the design includes an NTC thermistor in
the ILIM resistive voltage-divider to thermally compen-
sate the current-limit threshold.
II
I
LIMIT LOW LOAD MAX
L
() ()
>−
Δ
2
V
IL
CV
SOAR
LOAD MAX
OUT OUT
()
Δ
()
2
2
V
VT
V
t
CV
VV T
V
t
SAG
OUT SW
IN
OFF MIN
OUT OUT
IN OUT SW
IN
OFF MIN
=
()
+
()
LI
LOAD(MAX)
2
Δ
()
()
2
II
I
PEAK LOAD MAX
L
=+
()
Δ
2
L
VV
f I LIR
V
V
IN OUT
SW LOAD MAX
OUT
IN
=
()
MAX8792
Single Quick-PWM Step-Down
Controller with Dynamic REFIN
______________________________________________________________________________________ 21
Foldback Current Limit
Including an additional resistor between ILIM and the
output automatically creates a current-limit threshold that
folds back as the output voltage drops (see Figure 7).
The foldback current limit helps limit the inductor cur-
rent under fault conditions, but must be carefully
designed in order to provide reliable performance
under normal conditions. The current-limit threshold
must not be set too low, or the controller will not reliably
power up. To ensure the controller powers up properly,
the minimum current-limit threshold (when V
OUT
= 0V)
must always be greater than the maximum load during
startup (which at least consists of leakage currents),
plus the maximum current required to charge the out-
put capacitors:
I
START
= C
OUT
x 1mV/μs + I
LOAD(START)
Output Capacitor Selection
The output filter capacitor must have low enough effec-
tive series resistance (ESR) to meet output ripple and
load-transient requirements. Additionally, the ESR
impacts stability requirements. Capacitors with a high
ESR value (polymers/tantalums) will not need additional
external compensation components.
In core and chipset converters and other applications
where the output is subject to large load transients, the
output capacitor’s size typically depends on how much
ESR is needed to prevent the output from dipping too
low under a load transient. Ignoring the sag due to
finite capacitance:
In low-power applications, the output capacitor’s size
often depends on how much ESR is needed to maintain
an acceptable level of output ripple voltage. The output
ripple voltage of a step-down controller equals the total
inductor ripple current multiplied by the output capaci-
tor’s ESR. The maximum ESR to meet ripple require-
ments is:
where f
SW
is the switching frequency.
R
Vf L
VV V
V
ESR
IN SW
IN OUT OUT
RIPPLE
()
RR
V
I
ESR PCB
STEP
LOAD MAX
+
()
Δ
()
C1
1μF
EN
OFFON
V
DD
V
CC
C2
1μF
PGOOD
R10
100kΩ
REFIN
R2
54.9kΩ
BST
LX
CBST
0.1μF
L1
C
OUT
TON
R3
97.6kΩ
GND/OPEN/REF/V
DD
DH
DL
FB
HILO
REF
ILIM
REF
R
TON
100kΩ
R5
100kΩ
R8
100kΩ
R4
100kΩ
AGND
AGND
PWR
PWR
PWR
AGND
AGND
PWR
AGND
AGND
1
10
12
2
13
7
6
5
4
3
GND (EP)
14
SKIP
11
8
9
OUTPUT
1.50V 10A
1.05V 7A
INPUT
4V TO 12V
5V BIAS
SUPPLY
MAX8792
C
IN
PWR
C3
1000pF
R1
49.9kΩ
Figure 7. Standard Application with Foldback Current-Limit Protection
SEE TABLE 1 FOR COMPONENT SELECTION.

MAX8792ETD+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Switching Controllers Single Quick-PWM Step-Down Controller
Lifecycle:
New from this manufacturer.
Delivery:
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