NB4N316M
www.onsemi.com
10
Figure 19. Typical Examples of the Application Interface
Receiver
A
Receiver
B
V
CCB
= 1.8 V 2.5 V or 3.3 V
V
CCA
= 1.8 V 2.5 V or 3.3 V
50 W 50 W
50 W 50 W
50 W 50 W
V
TT
= V
CCB
V
TT
= V
CCB
V
TT
= V
CCA
Z = 50 W
Z = 50 W
Z = 50 W
Z = 50 W
NB4N316M
Receiver
C
Receiver
D
V
CCD
= 1.8 V 2.5 V or 3.3 V
V
CCC
= 1.8 V 2.5 V or 3.3 V
V
CC
= 3.3 V
V
EE
= 0 V
100 W 100 W
75 W 75 W
V
TT
= V
CCD
V
TT
= V
CCC
Z = 75 W
Z = 75 W
Z = 100 W
Z = 100 W
NB4N316M
NB4N316M
NB4N316M
V
EE
= 0 V
V
CC
= 3.3 V
V
EE
= 0 V
V
CC
= 3.3 V
V
CC
= 3.3 V
V
EE
= 0 V
NB4N316M
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11
ORDERING INFORMATION
Device Package Shipping
NB4N316MDTG TSSOP−8
(Pb−Free)
100 Units / Rail
NB4N316MDTR2G TSSOP−8
(Pb−Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
NB4N316M
www.onsemi.com
12
PACKAGE DIMENSIONS
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C 0.80 1.10 0.031 0.043
D 0.05 0.15 0.002 0.006
F 0.40 0.70 0.016 0.028
G 0.65 BSC 0.026 BSC
L 4.90 BSC 0.193 BSC
M 0 6 0 6
____
SEATING
PLANE
PIN 1
1
4
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
8x REFK
IDENT
K 0.25 0.40 0.010 0.016
TSSOP−8
DT SUFFIX
CASE 948R−02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
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P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NB4N316M/D
AnyLevel and ECLinPS are trademarks of Semiconductor Components INdustries, LLC (SCILLC).
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NB4N316MDTG

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Manufacturer:
ON Semiconductor
Description:
Bus Receivers CML BUFF/TRANS HYST
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