SCA61T Series
Subject to changes 17/17
www.murata.com Doc. nr. 8261900 Rev.A3
4.2 Reflow Soldering
The SCA61T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 17. Recommended SCA61T body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Profile feature Sn-Pb Eutectic
Pb-free Assembly
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature min (T
smin
)
- Temperature max (T
smax
)
100°C
150°C
150°C
200°C
Time maintained above:
- Temperature (T
L
)
183°C
217°C
Time within 5°C of actual Peak Temperature (T
P
)
Time 25° to Peak temperature
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
• Preheating time and temperatures according to solder paste manufacturer.
• It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
• Wave soldering is not recommended.
• Ultrasonic cleaning is not allowed. The sensing element may be damaged by ultrasonic
cleaning process.
