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74AUP2G80GF,115
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P25
74AUP2G80
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights rese
rved.
Product data sheet
Rev
. 8 — 21 Janu
ary 2013
18 of 24
NXP Semiconductors
74AUP2G80
Low-power dual D-type flip-flop; positive-e
dge trigger
Fig 15.
Package
outline SOT902-2 (XQF
N8)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEIT
A
SOT902-2
- - -
MO-255
- - -
sot902-2_po
10-1
1-02
1
1-03-31
Unit
(1)
mm
max
nom
min
0.5
0.05
0.00
1.65
1.60
1.55
1.65
1.60
1.55
0.55
0.5
0.15
0.10
0.05
0.1
0.05
A
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-2
A
1
b
0.25
0.20
0.15
DE
e
e
1
L
0.35
0.30
0.25
L
1
vw
0.05
yy
1
0.05
0
1
2 mm
scale
terminal 1
index area
B
A
D
E
X
C
y
C
y
1
terminal 1
index area
3
L
L
1
b
e
1
e
A
C
B
v
C
w
2
1
5
6
7
metal area
not for soldering
8
4
A
1
A
detail X
74AUP2G80
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights rese
rved.
Product data sheet
Rev
. 8 — 21 Janu
ary 2013
19 of 24
NXP Semiconductors
74AUP2G80
Low-power dual D-type flip-flop; positive-e
dge trigger
Fig 16.
Package
outline SOT1
1
16 (XSON8)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1116
sot1116_po
10-04-02
10-04-07
Unit
mm
max
nom
min
0.35
0.04
1.25
1.20
1.15
1.05
1.00
0.95
0.55
0.3
0.40
0.35
0.32
A
(1)
Dimensions
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.0 x 0.35 mm
SOT1116
A
1
b
0.20
0.15
0.12
DE
e
e
1
L
0.35
0.30
0.27
L
1
0
0.5
1 mm
scale
terminal 1
index area
E
D
(4
×
)
(2)
(8
×
)
(2)
A
1
A
e
1
e
1
e
1
e
L
L
1
b
4
3
2
1
5
6
7
8
74AUP2G80
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
. 2013. All rights rese
rved.
Product data sheet
Rev
. 8 — 21 Janu
ary 2013
20 of 24
NXP Semiconductors
74AUP2G80
Low-power dual D-type flip-flop; positive-e
dge trigger
Fig 17.
Package
outline SOT1203 (XSON
8)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1203
sot1203_po
10-04-02
10-04-06
Unit
mm
max
nom
min
0.35
0.04
1.40
1.35
1.30
1.05
1.00
0.95
0.55
0.35
0.40
0.35
0.32
A
(1)
Dimensions
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1.0 x 0.35 mm
SOT1203
A
1
b
0.20
0.15
0.12
DE
e
e
1
L
0.35
0.30
0.27
L
1
0
0.5
1 mm
scale
terminal 1
index area
E
D
(4
×
)
(2)
(8
×
)
(2)
A
A
1
e
L
L
1
b
e
1
e
1
e
1
1
8
2
7
3
6
4
5
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P25
74AUP2G80GF,115
Mfr. #:
Buy 74AUP2G80GF,115
Manufacturer:
Nexperia
Description:
Flip Flops Low-Power dual D-type flip-flop
Lifecycle:
New from this manufacturer.
Delivery:
DHL
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Ups
TNT
EMS
Payment:
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