VISHAY SILICONIX
Power MOSFETs
Application Note AN917
Dual-Channel LITTLE FOOT
®
6-Pin SC-70 MOSFET Copper Leadframe Version
Recommended Pad Pattern and Thermal Performance 175 °C Rated Part
APPLICATION NOTE
Revision: 15-Apr-13
1
Document Number: 75130
For technical questions, contact: powermosfettechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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INTRODUCTION
The new dual 6-pin SC-70 package with a copper leadframe
enables improved on-resistance values and enhanced
thermal performance as compared to the existing 3-pin and
6-pin packages with Alloy 42 leadframes. These devices are
intended for small to medium load applications where a
miniaturized package is required. Devices in this package
come in a range of on-resistance values, in n-channel and
p-channel versions. This technical note discusses pin-outs,
package outlines, pad patterns, evaluation board layout,
and thermal performance for the dual-channel version.
PIN-OUT
Figure 1 shows the pin-out description and pin 1
identification for the dual-channel SC-70 device in the 6-pin
configuration. Both n-and p-channel devices are available in
this package – the drawing example below illustrates the
p-channel device.
Fig. 1
For package dimensions see outline drawing SC-70
(6-Leads) (www.vishay.com/doc?71154)
BASIC PAD PATTERNS
See Application Note 826, Recommended Minimum Pad
Patterns With Outline Drawing Access for Vishay Siliconix
MOSFETs, (www.vishay.com/doc?72286
) for the SC-70
6-pin basic pad layout and dimensions. This pad pattern is
sufficient for the low-power applications for which this
package is intended. Increasing the drain pad pattern
(figure 2) yields a reduction in thermal resistance and is a
preferred footprint.
Fig. 2 SC-70 (6 leads) Dual
EVALUATION BOARD FOR THE DUAL-CHANNEL
SC70-6
The 6-pin SC-70 evaluation board (EVB) shown in figure 3
measures 0.6 in. by 0.5 in. The copper pad traces are the
same as described in the previous section, Basic Pad
Patterns. The board allows for examination from the outer
pins to the 6-pin DIP connections, permitting test sockets to
be used in evaluation testing.
The thermal performance of the dual 6-pin SC-70 has been
measured on the EVB, comparing both the copper and Alloy
42 leadframes. This test was then repeated using the
1-inch
2
PCB with dual-side copper coating.
A helpful way of displaying the thermal performance of the
6-pin SC-70 dual copper leadframe is to compare it to the
traditional Alloy 42 version.
SOT-363
SC-70 (6-LEADS)
6
4
1
2
3
5
Top View
S
1
G
1
D
2
D
1
G
2
S
2
48 (mil)
16 (mil)
654
321
61 (mil)
26 (mil)
8 (mil)
0.0 (mil)
23 (mil)
71 (mil)
96 (mil)
26 (mil)
87 (mil)
