NCV8518
http://onsemi.com
4
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage V
IN
, ENABLE −0.3 to 45 V
Output Voltage V
OUT
−0.3 to +7.0 V
RESET Voltage V
RESET
0 V to V
OUT
V
RESET Current
(RESET
may be incidentally shorted either to V
OUT
or to GND without damage)
I
RESET
Internally
Limited
mA
ESD Susceptibility (Human Body Model) − 2.0 kV
Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay) − −0.3 to +7.0 V
Operating Junction Temperature T
J
−40 to150 °C
Storage Temperature Range T
S
−55 to +150 °C
Moisture Sensitivity Level
SOIC−16 EP (Case 751R)
SOIC−8 EP (Case 751AC)
MSL
1
2
Lead Temperature Soldering: Reflow
Leaded Part 60−150 sec above 183°C, 30 sec max at peak
Lead−Free Part 60−150 sec above 217°C, 40 sec max at peak
−
−
240 peak
265 peak
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Parameter Board/Mounting Conditions Typical Value Unit
SO−8 Exposed Pad Package
100 sq. mm spreader board (Note 1) 1 sq. inch spreader board (Note 2)
Junction to case top (Y
JT
)
14 14 °C/W
Junction to lead1 (Y
JL1
)
36 26 °C/W
Junction to board (Y
JB
) (Note 3)
15 14 °C/W
Junction to ambient (q
JA
)
126 80 °C/W
SO−16 Exposed Pad Package
100 sq. mm spreader board (Note 1) 1 sq. inch spreader board (Note 2)
Junction to case top (Y
JT
)
20 20 °C/W
Junction to lead1 (Y
JL1
)
41 26 °C/W
Junction to board (Y
JB
) (Note 3)
12 12 °C/W
Junction to ambient (q
JA
)
113 70 °C/W
Specific notes on thermal characterization conditions:
All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical
values are derived from an axisymmetric finite−element model where active die area, total die area, flag area, pad area, and board area are
equated to the actual corresponding areas.
1. 1 oz copper, 100 mm
2
(0.155 in
2
) spreader area (includes exposed pad).
2. 1 oz copper, 645 mm
2
(1 in
2
) spreader area (includes exposed pad).
3. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
best represents the primary heat flow path and is least sensitive to board and ambient properties.