28
AT94S Secure Family
2314D–FPSLI–2/04
Ordering Information
Usable Gates Speed Grade Ordering Code Package Operation Range
5,000 25 MHz
AT94S05AL-25DGC 256ZA
Commercial
(0°C - 70°C)
AT94S05AL-25DGI 256ZA
Industrial
(-40°C - 85°C)
10,000 25 MHz
AT94S10AL-25DGC 256ZA
Commercial
(0°C - 70°C)
AT94S10AL-25BQC 144L1
AT94S10AL-25DGI 256ZA
Industrial
(-40°C - 85°C)
AT94S10AL-25BQI 144L1
40,000 16 MHz
AT94S40AL-25DGC 256ZA
Commercial
(0°C - 70°C)
AT94S40AL-25BQC 144L1
AT94S40AL-25DGI 256ZA
Industrial
(-40°C - 85°C)
AT94S40AL-25BQI 144L1
Package Type
256ZA 256-ball, Chip Array Ball Grid Array Package (CABGA)
144L1 144-lead, Low Profile Plastic Gull Wing Quad Flat Package (LQFP)
29
AT94S Secure Family
2314D–FPSLI–2/04
Packaging Information
256ZA – CABGA
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
256ZA, 256-ball (16 x 16 Array), 17 x 17 mm Body,
Chip Array Ball Grid Array (CABGA) Package
A
256ZA
11/07/01
Top View
123
A1
Ball Pad Corner
45678
A
B
D
C
E
910111214 131516
G
J
H
K
M
L
N
P
R
T
1.00 REF
1.00 REF
Bottom View
(256 SOLDER BALLS)
F
D
A1
Ball Pad Corner
E
Side View
A2
b
A1
A3
A
e
e
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 17 BSC
E 17 BSC
A 1.30 1.40 1.50
A1 0.31 0.36 0.41
A2 0.29 0.34 0.39
A3 0.65 0.70 0.75
e 1.00 BSC
b 0.46 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-205 for proper dimensions, tolerances, datums, etc.
2. Array as seen from the bottom of the package.
30
AT94S Secure Family
2314D–FPSLI–2/04
144L1 – LQFP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
144L1 A
11/30/01
144L1, 144-lead (20 x 20 x 1.4 mm Body), Low Profile
Plastic Quad Flat Pack (LQFP)
A1
A2
Bottom View
Side View
Top View
N
T
Y
R
U
C
O
L1
XX
E1
D1
e
D
E
b
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
1. This drawing is for general information only; refer to JEDEC Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic
body size dimensions including mold mismatch.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum
b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and
an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
A1 0.05 0.15 6
A2 1.35 1.40 1.45
D 22.00 BSC
D1 20.00 BSC 2, 3
E 22.00 BSC
E1 20.00 BSC 2, 3
e 0.50 BSC
b 0.17 0.22 0.27 4, 5
L1 1.00 REF
Notes:

AT94S40AL-25BQC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
FPGA - Field Programmable Gate Array ASICS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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