IRLR120NTRPBF

HEXFET
®
Power MOSFET
S
D
G
V
DSS
= 100V
R
DS(on)
= 0.185Ω
I
D
= 10A
Description
l Surface Mount (IRLR120N)
l Straight Lead (IRLU120N)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
l Lead-Free
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve the lowest possible
on-resistance per silicon area. This benefit, combined with the
fast switching speed and ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer with
an extremely efficient device for use in a wide variety of
applications.
The D-PAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight lead
version (IRFU series) is for through-hole mounting applications.
Power dissipation levels up to 1.5 watts are possible in typical
surface mount applications.
IRLR120NPbF
IRLU120NPbF
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 10
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 7.0 A
I
DM
Pulsed Drain Current  35
P
D
@T
C
= 25°C Power Dissipation 48 W
Linear Derating Factor 0.32 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
E
AS
Single Pulse Avalanche Energy 85 mJ
I
AR
Avalanche Current 6.0 A
E
AR
Repetitive Avalanche Energy 4.8 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
1 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback July 9, 2014
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 3.1
R
θJA
Junction-to-Ambient (PCB mount) ** –– 50 °C/W
R
θJA
Junction-to-Ambient ––– 110
Thermal Resistance
D-Pak
IRLR120NPbF
G
S
D
D
S
G
I-Pak
IRLU120NPbF
Form
Quantity
Tube 75 IRLR120NPbF
Tape and Reel 2000 IRLR120NTRPbF
Tape and Reel Left 3000 IRLR120NTRLPbF
Tape and Reel Right
3000 IRLR120NTRRPbF EOL notice # 289
IRLU120NPbF IPak Tube 75 IRLU120NPbF
NotePackage Type
Standard Pack
Orderable Part NumberBase Part Number
IRLR120NPbF D-Pak
2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback July 9, 2014
IRLR/U120NPbF
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 100 ––– ––– V V
GS
= 0V, I
D
= 250μA
ΔV
(BR)DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient ––– 0.12 –– V/°C Reference to 25°C, I
D
= 1mA
––– ––– 0.185 V
GS
= 10V, I
D
= 6.0A
–– –– 0.225 Ω V
GS
= 5.0V, I
D
= 6.0A
––– ––– 0.265 V
GS
= 4.0V, I
D
= 5.0A
V
GS(th)
Gate Threshold Voltage 1.0 ––– 2.0 V V
DS
= V
GS
, I
D
= 250μA
g
fs
Forward Transconductance 3.1 ––– ––– S V
DS
= 25V, I
D
= 6.0A
––– ––– 25
μA
V
DS
= 100V, V
GS
= 0V
––– ––– 250 V
DS
= 80V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -16V
Q
g
Total Gate Charge ––– –– 20 I
D
= 6.0A
Q
gs
Gate-to-Source Charge –– ––– 4.6 nC V
DS
= 80V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 10 V
GS
= 5.0V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time ––– 4.0 ––– V
DD
= 50V
t
r
Rise Time ––– 35 ––
ns
I
D
= 6.0A
t
d(off)
Turn-Off Delay Time ––– 23 –– R
G
= 11Ω, V
GS
= 5.0V
t
f
Fall Time ––– 22 ––– R
D
= 8.2Ω, See Fig. 10 
Between lead,
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 440 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 97 –– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 50 –– ƒ = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
nH
I
GSS
S
D
G
L
S
Internal Source Inductance ––– 7.5 –––
R
DS(on)
Static Drain-to-Source On-Resistance
L
D
Internal Drain Inductance  4.5 
I
DSS
Drain-to-Source Leakage Current
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) 
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 6.0A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 110 160 ns T
J
= 25°C, I
F
=6.0A
Q
rr
Reverse RecoveryCharge ––– 410 620 nC di/dt = 100A/μs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
A
10
35
Notes:
V
DD
= 25V, starting T
J
= 25°C, L = 4.7mH
R
G
= 25Ω, I
AS
= 6.0A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
I
SD
6.0A, di/dt 340A/μs, V
DD
V
(BR)DSS
,
T
J
175°C
Uses IRL520N data and test conditions.
This is applied for I-PAK, L
S
of D-PAK is measured between lead and
center of die contact
Pulse width 300μs; duty cycle 2%.
3 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback July 9, 2014
IRLR/U120NPbF
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
0.1
1
10
100
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20μs PULSE WIDTH
T = 25°C
J
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
0.1
1
10
100
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20μs PULSE WIDTH
T = 175°C
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
J
0.1
1
10
100
246810
T = 25°C
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
T = 175°C
J
A
V = 50V
20μs PULSE WIDTH
DS
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
V = 10V
GS
A
I = 10A
D

IRLR120NTRPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET 100V 1 N-CH HEXFET 185mOhms 13.3nC
Lifecycle:
New from this manufacturer.
Delivery:
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