HMC939ATCPZ-EP Data Sheet
Rev. 0 | Page 4 of 8
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage
Negative −7 V
Digital Control Input Voltage, V
CTL
V
DD
+ 0.5 V
RF Input Power (All Attenuation States,
f = 0.1 GHz to 33 GHz, T
CASE
= 85°C)
27 dBm
Continuous Power Dissipation, P
DISS
CASE
(T
CASE
= 105°C)
1
0.314 W
(T
CASE
= 125°C)
1
0.174 W
Temperature
Junction, T
J
150°C
Case, T
CASE
−55°C to +125°C
Storage −65°C to +150°C
Reflow
2
Moisture Sensitivity Level 3
(MSL3) Rating
260°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 250 V (Class 1A)
1
See Figure 2.
2
See the Ordering Guide for more information.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θ
JC
is the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
CP-24-22
1
213 143.5
2
°C/W
1
Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board with nine thermal vias. See JEDEC JESD51.
2
The device is set to maximum attenuation state.
POWER DERATING CURVE
0
0.2
0.4
0.6
0.8
1.0
1.2
–60 –40 –20 0 20 40 60 80 100 120
MAXIMUM POWER DISSI
PATION (W)
CASE TEMPERATURE (°C)
16267-002
Figure 2. Maximum Power Dissipation vs. Case Temperature (T
CASE
)
ESD CAUTION
