HMC939ATCPZ-EP Data Sheet
Rev. 0 | Page 8 of 8
OUTLINE DIMENSION
0.50
BSC
0.50
0.40
0.30
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGD-8.
BOTTOM VIEW
TOP VIEW
4.10
4.00 SQ
3.90
0.90
0.85
0.80
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
712
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
10-04-2016-A
0.30
0.25
0.18
0.20 MIN
2.70
2.60 SQ
2.50
EXPOSED
PAD
PKG-005268
SEATING
PLANE
P
I
N
1
I
N
D
I
C
A
T
O
R
A
R
E
A
O
P
T
I
O
N
S
(
S
E
E
D
E
T
A
I
L
A
)
DETAIL A
(JEDEC 95)
Figure 11. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.85 mm Package Height
(CP-24-22)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description Package Option
HMC939ATCPZ-EP-PT −55°C to +125°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] CP-24-22
HMC939ATCPZ-EP-R7 −55°C to +125°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] CP-24-22
1
All models are RoHS compliant devices.
2
See the Absolute Maximum Ratings section.
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D16267-0-10/17(0)