SpecNo.JENF243J-0003B-01 P3/9
MURATA MFG.CO., LTD
Reference
Only
No. Item Specification Test Method
7.3 Vibration Chip Noise Filter shall not be
damaged.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 min
Total amplitude : 1.5 mm or Acceleration amplitude
98 m/s
2
whichever is smaller.
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6 hours)
7.4 Solderability The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Impedance Change: within ± 10%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance: No damage
Impedance Change: within ± 10%
DC Resistance Change: within ± 10%
Temperature: 105±2°C
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: +105±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
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