NFZ32BW8R4HN11L

SpecNo.JENF243J-0003B-01 P4/9
MURATA MFG.CO., LTD
Reference
Only
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
165 to 180 degree
F
Cover tape
Plastic tape
190 min
2.0±0.5
13.0±0.2
21.0±0.8
210 min
60±
13±1.4
180
±
0
3
1
0
(in mm)
Trailer
:
160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
0
1
Dimension of the Cavity is measured
at the bottom side.
2.9±0.2
2.0±0.05
4.0±0.1
Direction of feed
1.7±0.2
Lead-in/out wire
4.0±0.1
3.6±0.2
8.0±0.2
1.75±0.13.5±0.05
1.5
-0
+0.1
0.2
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
SpecNo.JENF243J-0003B-01 P5/9
MURATA MFG.CO., LTD
Reference
Only
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2), Quantity etc ・・・
1) « Expression of Inspection No. » □□
OOOO 
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer
Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (7) Traffic signal equipment
(2) Aerospace equipment (8) Disaster prevention / crime prevention equipment
(3) Undersea equipment (9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land pattern for flow and reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(Reflow) (Flow)
( (in mm)
W
D
Label
H
4.8
2.2
1.3
0.8
2.5
Chip Noise Filter
Land
Solder Resist
Land
Chip Noise Filter
Solder Resist
(in mm)
SpecNo.JENF243J-0003B-01 P6/9
MURATA MFG.CO., LTD
Reference
Only
(Distance between the products for Flow)
(in mm)
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
11.3 Flow soldering conditions / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(1)Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、4s6s 265±3℃、5s
Cycle of flow 2 times 1 time
265±3℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
250

NFZ32BW8R4HN11L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Ferrite Beads 1210 8.4ohm 30%
Lifecycle:
New from this manufacturer.
Delivery:
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