NFZ32BW8R4HN11L Datasheet NFZ32BW650HN11L, NFZ32BW8R4HN11L, NFZ32BW101HN11L | P7-P9

SpecNo.JENF243J-0003B-01 P7/9

MURATA MFG.CO., LTD

Reference

Only

(2)Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C,10s

Cycle of reflow 2 times 2 times

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3 (+1,-0)s

Times 2 times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

11.5 Solder Volume

･ Solder shall be used not to be exceeded the upper limits as shown below.

･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦ t ≦T

(T: Lower flange thickness)

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a

b) to the mechanical

stress.

150

90s±30s

Time(s)

245℃±3℃

Temp.

(℃)

220℃

30s～60s

180

260℃

230℃

60s max

Limit Profile

Standard Profile

Recommendable

Uppre Limit

Ｔ

〈

Poor example

〉

〈

Good example

〉

SpecNo.JENF243J-0003B-01 P8/9

MURATA MFG.CO., LTD

Reference

Only

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A

CB  D.

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.

(3) Cleaner

1. Alternative cleaner



Isopropyl alcohol (IPA)

2. Aqueous agent



PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water

in order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An

open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,

please pay your careful attention when you select resin in case of coating/molding the products with the

resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products

mounted on your board.

11.9 Caution for use

 Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

 Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening

screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

Seam

Slit

Length:a



SpecNo.JENF243J-0003B-01 P9/9

MURATA MFG.CO., LTD

Reference

Only

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

 Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,

chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

 Products should not be stored on bulk packaging condition to prevent the chipping of the core and the

breaking of winding wire caused by the collision between the products.

 Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

 Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

12.

Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

P1-P3 P4-P6 P7-P9

NFZ32BW8R4HN11L

Mfr. #:

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Manufacturer:

Murata Electronics

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Ferrite Beads 1210 8.4ohm 30%

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NFZ32BW8R4HN11L

NFZ32BW8R4HN11L

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