TCND5000
www.vishay.com
Vishay Semiconductors
Rev. 1.6, 12-Jun-14
8
Document Number: 83795
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PRECAUTIONS FOR USE
1. Over-current-proof
Customer must apply resistors for protection, otherwise
slight voltage shift will cause big current change (Burn out
will happen).
2. Storage
2.1 Storage temperature and rel. humidity conditions are:
5 °C to 30 °C, RH 60 %
2.2 Floor life must not exceed 72 h, acc. to JEDEC
®
level 4,
J-STD-020.
Once the package is opened, the products should be
used within 72 h. Otherwise, they should be kept in a
damp proof box with desiccant.
Considering tape life, we suggest to use products within
one year from production date.
2.3 If opened more than 72 h in an atmosphere 5 °C to
30 °C, RH 60 %, devices should be treated at 60 °C ±
5 °C for 15 h.
2.4 If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3
REFLOW SOLDER PROFILES
Fig. 14 - Lead (Pb)-Free Reflow Solder Profile
Fig. 15 - Lead Tin (SnPb) Reflow Solder Profile
300
250
200
150
100
50
0
0
Temperature (°C)
max. 20 s
max. 120 s max. 100 s
255 °C
240 °C
217 °C
max. 260 °C
245 °C
max. Ramp up 3°C/s max. Ramp down 6°C/s
Time (s)
19003
300
250
200
150100
50
max. 160 °C
Full Line: Typical
Dotted: Process Limits
Time (s)
Temperature (°C)
Lead Temperature
90 s to 120 s
300
250
200
150
100
50
0
0
max. 240 °C ca. 230 °C
10 s
215 °C
max 40 s
2 K/s to 4 K/s
948625
250200
150
100 50
