__________Applications Information
Power-On Reset
At power-up, the internal power-supply circuitry sets INT
high and puts the device in normal operation / external
clock mode. This state is selected to keep the internal
clock from loading the external clock driver when the
part is used in external clock mode.
Internal or External Reference
The MAX199 can operate with either an internal or external
reference. An external reference can be connected to
either the REF pin or to the REFADJ pin (Figure 9).
To use the REF input directly, disable the internal buffer
by tying REFADJ to V
DD
. Using the REFADJ input elimi-
nates the need to buffer the reference externally.
When the reference is applied at REFADJ, bypass
REFADJ with a 0.01µF capacitor to AGND.
The REFADJ internal buffer gain is trimmed to 1.6384 to
provide 4.096V at the REF pin from a 2.5V reference.
Internal Reference
The internally trimmed 2.50V reference is gained
through the REFADJ buffer to provide 4.096V at REF.
Bypass the REF pin with a 4.7µF capacitor to AGND
and the REFADJ pin with a 0.01µF capacitor to AGND.
The internal reference voltage is adjustable to ±1.5%
(±65 LSBs) with the reference-adjust circuit of Figure 1.
External Reference
At REF and REFADJ, the input impedance is a mini-
mum of 10kfor DC currents. During conversions, an
external reference at REF must be able to deliver
400µA DC load currents, and must have an output
impedance of 10or less. If the reference has higher
input impedance or is noisy, bypass it close to the REF
pin with a 4.7µF capacitor to AGND.
With an external reference voltage of less than 4.096V
at the REF pin or less than 2.5V at the REFADJ pin, the
increase in the ratio of the RMS noise to the LSB value
(FS / 4096) results in performance degradation (loss of
effective bits).
MAX199
Multi-Range (±4V, ±2V, +4V, +2V),
+5V Supply, 12-Bit DAS with 8+4 Bus Interface
______________________________________________________________________________________ 13
REF
10k
2.5V
26 4.096V
4.7µF
C
REF
0.01µF
25REFADJ
A
V
= 1.638
MAX199
Figure 9a. Internal Reference
REF
10k
2.5V
26 4.096V
4.7µF
C
REF
2.5V
25REFADJ
A
V
= 1.638
0.01µF
MAX199
Figure 9c. The external reference at REFADJ overdrives the
internal reference.
REF
V
DD
10k
2.5V
26
4.096V
4.7µF
C
REF
25REFADJ
A
V
= 1.638
MAX199
Figure 9b. External Reference at REF
MAX199
Power-Down Mode
To save power, you can put the converter into low-
current shutdown mode between conversions. Two
programmable power-down modes are available, in
addition to a hardware shutdown. Select STBYPD or
FULLPD by programming PD0 and PD1 in the input
control byte. When software power-down is asserted, it
becomes effective only after the end of conversion. In all
power-down modes, the interface remains active and
conversion results may be read. Input overvoltage pro-
tection is active in all power-down modes. The device
returns to normal operation on the first WR falling edge
during a write operation.
For hardware-controlled (FULLPD) power-down, pull
the SHDN pin low. When hardware shutdown is assert-
ed, it becomes effective immediately and the conver-
sion is aborted.
Choosing Power-Down Modes
The bandgap reference and reference buffer remain
active in STBYPD mode, maintaining the voltage on the
4.7µF capacitor at the REF pin. This is a “DC” state that
does not degrade after power-down of any duration.
Therefore, you can use any sampling rate with this
mode, without regard to start-up delays.
However, in FULLPD mode, only the bandgap refer-
ence is active. Connect a 33µF capacitor between REF
and AGND to maintain the reference voltage between
conversion and to reduce transients when the buffer is
enabled and disabled. Throughput rates down to 1ksps
can be achieved without allotting extra acquisition time
for reference recovery prior to conversion. This allows a
conversion to begin immediately after power-down
ends. If the discharge of the REF capacitor during
FULLPD exceeds the desired limits for accuracy (less
than a fraction of an LSB), run a STBYPD power-down
cycle prior to starting conversions. Take into account
that the reference buffer recharges the bypass capaci-
tor at an 80mV/ms slew rate and add 50µs for settling
time. Throughput rates of 10ksps offer typical supply
currents of 470µA, using the recommended 33µF
capacitor value.
Auto-Shutdown
Selecting STBYPD on every conversion automatically
shuts the MAX199 down after each conversion without
requiring any start-up time on the next conversion.
Multi-Range (±4V, ±2V, +4V, +2V),
+5V Supply, 12-Bit DAS with 8+4 Bus Interface
14 ______________________________________________________________________________________
OUTPUT CODE
INPUT VOLTAGE (LSB)
0
FS
FS -
3
/
2
LSB
1 LSB =
FULL-SCALE
TRANSITION
123
11... 111
11... 110
11... 101
00... 011
00... 010
00... 001
00... 000
FS
4096
Figure 10. Unipolar Transfer Function
OUTPUT CODE
INPUT VOLTAGE (LSB)
0V +FS - 1 LSB
1 LSB =
-FS
011... 111
011... 110
000... 001
000... 000
111... 111
100... 010
100... 001
100... 000
2FS
4096
Figure 11. Bipolar Transfer Function
Transfer Function
Output data coding for the MAX199 is binary in unipolar
mode with 1LSB = (FS / 4096) and twos-complement
binary in bipolar mode with 1LSB = [(2 x
|
FS
|
) / 4096].
Code transitions occur halfway between successive-
integer LSB values. Figures 10 and 11 show the
input/output (I/O) transfer functions for unipolar and
bipolar operations, respectively.
Layout, Grounding, and Bypassing
Careful printed circuit board layout is essential for best
system performance. For best performance, use a
ground plane. To reduce crosstalk and noise injection,
keep analog and digital signals separate. Digital
ground lines can run between digital signal lines to
minimize interference. Connect analog grounds and
DGND in a star configuration to AGND. For noise-free
operation, ensure the ground return from AGND to the
supply ground is low impedance and as short as possi-
ble. Connect the logic grounds directly to the supply
ground. Bypass V
DD
with 0.1µF and 4.7µF capacitors
to AGND to minimize high- and low-frequency fluctua-
tions. If the supply is excessively noisy, connect a 5
resistor between the supply and V
DD
, as shown in
Figure 12.
MAX199
Multi-Range (±4V, ±2V, +4V, +2V),
+5V Supply, 12-Bit DAS with 8+4 Bus Interface
______________________________________________________________________________________ 15
_Ordering Information (continued)
28 Narrow Ceramic SB**-55°C to +125°CMAX199BMYI
28 Narrow Ceramic SB**-55°C to +125°CMAX199AMYI
28 SSOP-40°C to +85°CMAX199BEAI
28 SSOP-40°C to +85°CMAX199AEAI
28 Wide SO-40°C to +85°CMAX199BEWI
28 Wide SO
28 Narrow Plastic DIP
28 Narrow Plastic DIP-40°C to +85°C
-40°C to +85°C
-40°C to +85°CMAX199AEWI
MAX199BENI
MAX199AENI
PIN-PACKAGETEMP. RANGEPART
V
DD
GND
DGND
DGNDAGND
+5V
+5V
SUPPLY
R* = 5
DIGITAL
CIRCUITRY
4.7µF
0.1µF
MAX199
**
* OPTIONAL
** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE
Figure 12. Power-Supply Grounding Connection
TRANSISTOR COUNT: 2956
SUBSTRATE CONNECTED TO GND
___________________Chip Topography
CH5
CH6
CH7
INT
REFADJ
0.231"
(5.870mm)
0.144"
(3.659mm)
D2
CH0
CH1D0
D1
AGND
CH4
CH3
CH2
V
CC
V
DD
REFDGND
CLKWR
CS
RD
HBEN
SHDN
D7
D6
D5
D4
D3
**
Contact factory for availability and processing to MIL-STD-883.

MAX199BCWI

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
IC DAS 12BIT 100KSPS BUS 28-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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