10 of 31 June 12, 2014
IDT 89HPES3T3 Data Sheet
Figure 5 JTAG AC Timing Waveform
Recommended Operating Supply Voltages
Power-Up/Power-Down Sequence
This section describes the sequence in which various voltages must be applied to the part during power-up to ensure proper functionality. For the
PES3T3, the power-up sequence must be as follows:
1. V
DD
I/O — 3.3V
2. V
DD
Core, V
DD
PE, V
DD
APE — 1.0V
3. V
TT
PE — 1.5V
When powering up, each voltage level must ramp and stabilize prior to applying the next voltage in the sequence to ensure internal latch-up issues
are avoided. There are no maximum time limitations in ramping to valid power levels.
The power-down sequence must be in the reverse order of the power-up sequence.
Symbol Parameter Minimum Typical Maximum Unit
V
DD
CORE Internal logic supply 0.9 1.0 1.1 V
V
DD
I/O I/O supply except for SerDes LVPECL/CML 3.135 3.3 3.465 V
V
DD
PE PCI Express Digital Power 0.9 1.0 1.1 V
V
DD
APE PCI Express Analog Power 0.9 1.0 1.1 V
V
TT
PE PCI Express Serial Data Transmit
Termination Voltage
1.425 1.5 1.575 V
V
SS
Common ground 0 0 0 V
Table 12 PES3T3 Operating Voltages
Tpw_16d
Tdz_16cTdo_16c
Thld_16b
Tsu_16b
Thld_16b
Tsu_16b
Tlow_16aTlow_16a
Tper_16a
Thigh_16a
JTAG_TCK
JTAG_TDI
JTAG_TMS
JTAG_TDO
JTAG_TRST_N
11 of 31 June 12, 2014
IDT 89HPES3T3 Data Sheet
Recommended Operating Temperature
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 12.
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 12.
All power measurements assume that the part is mounted on a 10 layer printed circuit board with 0 LFM airflow.
Thermal Considerations — Option A Package
This section describes thermal considerations for the PES3T3 (13mm
2
BCG144 package). The data in Table 15 below contains information that is
relevant to the thermal performance of the PES3T3 switch.
Grade Temperature
Commercial 0C to +70C Ambient
Industrial -40
C to +85C Ambient
Table 13 PES3T3 Operating Temperatures
Number of
Connected
Lanes
Core Supply
PCIe Digital
Supply
PCIe Analog
Supply
PCIe Termin-
ation Supply
I/O Supply Total (Watts)
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.5V
Max
1.575V
Typ
3.3V
Max
3.465V
Typ Max
1/1/1 mA 254 330 173 220 99 117 75 94 3 3.3
Watts 0.25 0.36 0.17 0.24 0.10 0.13 0.11 0.15 0.01 0.01 0.65 0.89
Table 14 PES3T3 Power Consumption
Symbol Parameter Value Units Conditions
T
J(max)
Junction Temperature 125
o
CMaximum
T
A(max)
Ambient Temperature 70
o
C Maximum for commercial-rated products
T
A(max)
Ambient Temperature 85
o
C Maximum for industrial-rated products
JA(effective)
Effective Thermal Resistance, Junction-to-Ambient
34.6
o
C/W Zero air flow
30.3
o
C/W 1 m/S air flow
28.4
o
C/W 2 m/S air flow
JB
Thermal Resistance, Junction-to-Board 18.8
o
C/W
JC
Thermal Resistance, Junction-to-Case 10
o
C/W
P Power Dissipation of the Device 0.89 Watts Maximum
Table 15 Thermal Specifications for PES3T3, 13x13mm BCG144 Package
12 of 31 June 12, 2014
IDT 89HPES3T3 Data Sheet
Thermal Considerations — Option B Package
This section describes thermal considerations for the PES3T3 (10mm
2
NQG132 package). The data in Table 16 below contains information that is
relevant to the thermal performance of the PES3T3 switch.
Symbol Parameter Value Units Conditions
T
J(max)
Junction Temperature 125
o
CMaximum
T
A(max)
Ambient Temperature 70
o
C Maximum for commercial-rated products
JA(effective)
Effective Thermal Resistance, Junction-to-Ambient
23.5
o
C/W Zero air flow
19.6
o
C/W 1 m/S air flow
17.4
o
C/W 2 m/S air flow
JB
Thermal Resistance, Junction-to-Board 0.2
o
C/W
JC
Thermal Resistance, Junction-to-Case 7.6
o
C/W
P Power Dissipation of the Device 0.89 Watts Maximum
Table 16 Thermal Specifications for PES3T3, 10x10mm NQG132 Package

89HPES3T3ZBBCG

Mfr. #:
Manufacturer:
IDT
Description:
PCI Interface IC PCI EXPRESS SWITCH
Lifecycle:
New from this manufacturer.
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