WeEn Semiconductors
BT136S-800F
4Q Triac
BT136S-800F All information provided in this document is subject to legal disclaimers.
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WeEn Semiconductors Co., Ltd. 2016. All rights reserved
Product data sheet 11 October 2016 6 / 13
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
half cycle; Fig. 6 - - 3.7 K/WR
th(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6 - - 3 K/W
R
th(j-a)
thermal resistance
from junction to
ambient free air
in free air; printed circuit board (FR4)
mounted; standard footprint, single-
sided copper, tin-plated
- 75 - K/W
003aae836
t
p
(s)
10
- 5
1 1010
- 1
10
- 2
10
- 4
10
- 3
1
10
- 1
10
Z
th(j-mb)
(K/W)
10
- 2
bidirectional
unidirectional
t
p
P
t
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width