DocID14672 Rev 2 13/15
DVIULC6-2x6 Package information
15
5 Package information
• Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at www.st.com.
Figure 23. µQFN 6 leads footprint dimensions in mm [inches]
Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Table 3. Micro QFN 1.45x1.00 6L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.50 0.55 0.60 0.020 0.022 0.024
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.18 0.25 0.30 0.007 0.010 0.012
D 1.45 0.057
E 1.00 0.039
e 0.50 0.020
K 0.20 0.008
L 0.30 0.35 0.40 0.012 0.014 0.016
E
D
A
A1
e
b
k
L
N
1
1
2
2
0.50
[0.020]
0.25
[0.010]
0.65
[0.026]
0.30
[0.012]
1.60
[0.063]
