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NLAST44599MN

P1-P3P4-P6P7-P9P10-P12P13-P13
NLAST44599
http://onsemi.com
10
Figure 22. R
ON
vs. Temp, V
CC
= 5.0 V Figure 23. R
ON
vs. Temp, V
CC
= 5.5 V
20
15
R
ON
()
10
25
V
IS
(VDC)
5
0
0.0 2.01.51.00.5 2.5 3.0 3.5 4.0 4.5 5.0
25°C
85°C
125°C
−55°C
20
15
R
ON
()
10
25
V
IS
(VDC)
5
0
0.0 2.01.51.00.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5
25°C
85°C
125°C
−55°C
DEVICE ORDERING INFORMATION
Device Order
Number
Device Nomenclature
Package Type Shipping
†
Circuit
Indicator
Technology
Device
Function
Package
Suffix
Tape and Reel
Suffix
NLAST44599DT NL AS 44599 DT TSSOP−16* 96 Unit / Rail
NLAST44599DTR2 NL AS 44599 DT R2 TSSOP−16* 2500 / Tape & Reel
NLAST44599MN NL AS 44599 MN QFN−16 124 Unit Rail
NLAST44599MNG NL AS 44599 MN QFN−16
(Pb−Free)
124 Unit Rail
NLAST44599MNR2 NL AS 44599 MN R2 QFN−16 2500 / Tape & Reel
NLAST44599MNR2G NL AS 44599 MN R2 QFN−16
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
NLAST44599
http://onsemi.com
11
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G−01
ISSUE D
16X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
1
4
58
12
9
16 13
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. L
max
CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
B
A
0.15 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.10 C
0.08 C
(A3)
C
16 X
e
16X
NOTE 5
0.10 C
0.05 C
A B
NOTE 3
K16X
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.65 1.85
e 0.50 BSC
K
L 0.30 0.50
EXPOSED PAD
0.18 TYP
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
L1 0.00 0.15
NLAST44599
http://onsemi.com
12
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P12P13-P13

NLAST44599MN

Mfr. #:
Buy NLAST44599MN
Manufacturer:
ON Semiconductor
Description:
IC SWITCH DUAL DPDT 16QFN
Lifecycle:
New from this manufacturer.
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