Data Sheet HMC219B
Rev. 0 | Page 27 of 27
OUTLINE DIMENSIONS
Figure 85. 8-Lead Mini Small Outline Package with Exposed Pad (MINI_SO_EP)
(RH-8-4)
Dimensions shown in millimeters)
ORDERING GUIDE
Model
1, 2
Temperature
Range
MSL
Rating
3
Package Body Material
Package
Description
Package
Option
Package
Marking
4
HMC219BMS8GE −40°C to +85°C MSL1 Low Stress Injection Molded Plastic 8-Lead MINI_SO_EP RH-8-4
XXXX
H219B
HMC219BMS8GETR −40°C to +85°C MSL1 Low Stress Injection Molded Plastic 8-Lead MINI_SO_EP RH-8-4
XXXX
H219B
EV1HMC219BMS8G
Evaluation PCB
Assembly
1
The HMC219BMS8GE and the HMC219BMS8GETR are RoHS Compliant Parts.
2
Lead finish, 100% SN 10 micron minimum.
3
See the Absolute Maximum Ratings section.
4
XXXX = four digit lot number.
0.95
0.85
0.75
0.38
0.30
0.22
COMPLIANT TO JEDEC STANDARDS MO-187-AA-T
3.10
3.00
2.90
3.10
3.00
2.90
5.08
4.90
4.68
0.80
0.60
0.40
0.13
MAX
0.95
REF
TOP VIEW
BOTTOM VIEW
SIDE VIEW
END VIEW
01-13-2017-A
PKG-004854
1
4
58
0.65
BSC
1.10
MAX
1.78
MAX
2.41
MAX
1.95 BSC
0.22
0.08
COPLANARITY
0.10
0.25 GAGE
PLANE
6°
0°
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15452-0-1/17(0)
