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HMC219BMS8GE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
Data Sheet HMC219B
Rev. 0 | Page 3 of 27
SPECIFICATIONS
T
A
= 25°C, IF = 100 MHz, LO power = 13 dBm, and all measurements performed as downconverter with lower sideband selected, unless
otherwise noted.
Table 1.
Parameter Min Typ Max Unit
FREQUENCY RANGE
RF 2.5 7.0 GHz
LO 2.5 7.0 GHz
IF DC 3 GHz
LO DRIVE LEVEL 13 dBm
PERFORMANCE
Conversion Loss 9 11 dB
Single-Sideband (SSB) Noise Figure 8 dB
Input Third-Order Intercept (IP3) 15 18 dBm
Input Second-Order Intercept (IP2) 55 dBm
LO to RF Isolation 34 40 dB
LO to IF Isolation 29 35 dB
RF to IF Isolation 22 dB
Input 1 dB Compression Point (P1dB) 11 dBm
RF Return Loss 10 dB
LO Return Loss 25 dB
IF Return Loss 12 dB
HMC219B Data Sheet
Rev. 0 | Page 4 of 27
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 27dBm
IF Input Power 25 dBm
IF Source and Sink Current 6 mA
Continuous Power Dissipation, P
DISS
(T
A
=
85°C, Derate 10.81 mW/°C Above 85°C)
972 mW
Maximum Junction Temperature 175°C
Maximum Peak Reflow Temperature (MSL1)
1
260°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 1500 V (Class 1C)
Field Induced Charged Device Model
(FICDM)
750 V (Class C4)
1
See the Ordering Guide.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
RM-8 194.9 92.5 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Data Sheet HMC219B
Rev. 0 | Page 5 of 27
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 6, 8 GND
Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic.
2 LO
Local Oscillator. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
4 NIC Not Internally Connected. Leave this pin floating.
5 IF Intermediate Frequency. This pin is dc-coupled. For applications not requiring operation to dc, externally block
this pin using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to
dc, this pin must not source or sink more than 6 mA of current or device nonfunction and possible device failure
results. See Figure 5 for the IF interface schematic.
7 RF
Radio Frequency. This pin is dc-coupled and matched to 50 Ω. See Figure 6 for the RF interface schematic.
INTERFACE SCHEMATICS
Figure 3. GND Interface Schematic
Figure 4. LO Interface Schematic
Figure 5. IF Interface Schematic
Figure 6. RF Interface Schematic
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
LEAVE THIS PIN FLOATING.
2. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
1
2
3
4
8
7
6
5
GND
HMC219B
TOP VIEW
(Not to Scale)
RF
IF
GND
GND
LO
NIC
GND
15452-002
GND
15452-003
IF
15452-005
RF
15452-006
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

HMC219BMS8GE

Mfr. #:
Buy HMC219BMS8GE
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixer
Lifecycle:
New from this manufacturer.
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