4
Absolute Maximum Ratings
Parameter Symbol Device Min. Max. Unit Conditions Fig. Note
Storage Temperature T
S
-55 125 °C
Operating Temperature T
A
HCPL-3100 -40 100 °C
HCPL-3101 -40 85
Input Continuous I
F
HCPL-3100 25 mA 11 1
HCPL-3101 20 mA 11 1
Reverse V
R
HCPL-3100 6 V T
A
= 25°C
Voltage HCPL-3101 5
Supply VoltageV
CC
35 V
Output 1 Continuous I
O1
0.1 A 1
Current
Peak Current 0.6 A Pulse Width < 0.15 µs, 1
Duty cycle = 1%
Voltage V
O1
35 V
Output 2 Continuous I
O2
0.1 A 1
Current
Peak Current 0.6 A Pulse Width < 0.15 µs, 1
Duty cycle = 1%
Output Power Dissipation P
O
500 mW 12 1
Total Power Dissipation P
T
550 mW 12 1
Lead Solder Temperature 270°C for 10 s, 1.0 mm below seating plane
Current
Insulation and Safety Related Specifications
Parameter Symbol Value Units Conditions
Min. External Air Gap L(IO1) 6.0 mm Shortest distance measured through air, between two
(External Clearance) conductive leads, input to output
Min. External Tracking L(IO2) 6.0 mm Shortest distance path measured along outside surface
Path (External of optocoupler body between input and output leads
Creepage)
Min. Internal Plastic 0.15 mm Through insulation distance conductor to conductor
Gap (Internal inside the optocoupler cavity
Clearance)
Demonstrated ESD
Performance
Human Body Model: MIL-STD-
883 Method 3015.7: Class 2
Machine Model: EIAJ IC-121-
1988 (1988.3.28 Version 2),
Test Method 20, Condition
C: 1200 V
Regulatory Information
The HCPL-3100/3101 has been
approved by the following
organization:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.