SSM2604 Data Sheet
Rev. A | Page 6 of 28
Table 5. Digital Audio Interface Master Mode Timing
Limit
Parameter t
MIN
t
MAX
Unit Description
t
DST
30 ns PBDAT setup time to BCLK rising edge
t
DHT
10 ns PBDAT hold time to BCLK rising edge
t
DL
10 ns RECLRC/PBLRC propagation delay from BCLK falling edge
t
DDA
10 ns RECDAT propagation delay from BCLK falling edge
t
BCLKR
10 ns BCLK rising time (10 pF load)
t
BCLKF
10 ns BCLK falling time (10 pF load)
t
BCLKDS
45:55:00 55:45:00 BCLK duty cycle (normal and USB mode)
BCLK
PBLRC/
RECLRC
PBDAT
RECDAT
t
DDA
t
DST
t
DHT
t
DL
0
6978-026
Figure 4. Digital Audio Interface Master Mode Timing
Table 6. System Clock Timing
Limit
Parameter t
MIN
t
MAX
Unit Description
t
XTIY
72 ns MCLK/XTI system clock cycle time
t
MCLKDS
40:60 60:40:00 MCLK/XTI duty cycle
t
XTIH
32 ns MCLK/XTI system clock pulse width high
t
XTIL
32 ns MCLK/XTI system clock pulse width low
t
COP
20 ns CLKOUT propagation delay from MCLK/XTI falling edge
t
COPDIV2
20 ns CLKODIV2 propagation delay from MCLK/XTI falling edge
t
COPDIV2
t
COP
MCLK/XTI
CLKOUT
CLKODIV2
t
XTIH
t
XTIL
t
XTIY
06978-035
Figure 5. System (MCLK) Clock Timing
Data Sheet SSM2604
Rev. A | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
At 25°C, unless otherwise noted.
Table 7.
Parameter Rating
Supply Voltage 3.6 V
Input Voltage V
DD
Common-Mode Input Voltage V
DD
Storage Temperature Range 65°C to +150°C
Operating Temperature Range 40°C to +85°C
Junction Temperature Range 65°C to +165°C
Lead Temperature (Soldering, 60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type θ
JA
θ
JC-TOP
θ
JC-BOTTOM
Unit
28-Lead, 5 mm × 5 mm LFCSP 52.7 31.4 1.52 °C/W
ESD CAUTION
SSM2604 Data Sheet
Rev. A | Page 8 of 28
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
06978-002
PIN 1
INDICATOR
1
MCLK/XTI
2XTO
3
DGND
4
DVDD
5CLKOUT
13 AVDD
14
AGND
15
VMID
12 ROUT
11
LOUT
6
BCLK
7
PBDAT
8
PBLRC
10
RECLRC
9
RECDAT
18
SDIN
19
SCLK
20
NC
17
LLINEIN
16
RLINEIN
TOP VIEW
(Not to Scale)
SSM2604
NOTES
1. NC = NO CONNECT.
2. FOR PROPER CONNECTION OF THE EXPOSED PAD,
CONNECT TO PCB GROUND LAYER
Figure 6. Pin Configuration
Table 9. Pin Function Descriptions
Pin No. Mnemonic Type Description
1 MCLK/XTI Digital Input Master Clock Input/Crystal Input.
2 XTO Digital Output Crystal Output.
3 DGND Digital Ground Digital Ground.
4 DVDD Digital Supply Digital Core and I/O Buffer Supply.
5 CLKOUT Digital Output Buffered Clock Output.
6 BCLK Digital Input/Output Digital Audio Bit Clock.
7
PBDAT
Digital Input
DAC Digital Audio Data Input, Playback Function.
8 PBLRC Digital Input/Output DAC Sampling Rate Clock, Playback Function (from Left and Right Channels).
9 RECDAT Digital Output ADC Digital Audio Data Output, Record Function.
10 RECLRC Digital Input/Output ADC Sampling Rate Clock, Record Function (from Left and Right Channels).
11 LOUT Analog Output Line Output for Left Channel.
12 ROUT Analog Output Line Output for Right Channel.
13 AVDD Analog Supply Analog Supply.
14 AGND Analog Ground Analog Ground.
15 VMID Analog Output Midrail Voltage Decoupling Input.
16 RLINEIN Analog Input Line Input for Right Channel.
17 LLINEIN Analog Input Line Input for Left Channel.
18 SDIN Digital Input/Output 2-Wire Control Interface Data Input/Output.
19 SCLK Digital Input 2-Wire Control Interface Clock Input.
20 NC NC No Connection
GND Pad Thermal Pad/Exposed Pad Center Thermal Pad. Connect to PCB ground layer.

SSM2604CPZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Interface - CODECs Low Power w/ 24B ADC & 24B DAC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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