SSM2604 Data Sheet
Rev. A | Page 8 of 28
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
06978-002
PIN 1
INDICATOR
1
MCLK/XTI
2XTO
3
DGND
4
DVDD
5CLKOUT
13 AVDD
14
AGND
15
VMID
12 ROUT
11
LOUT
6
BCLK
7
PBDAT
8
PBLRC
10
RECLRC
9
RECDAT
18
SDIN
19
SCLK
20
NC
17
LLINEIN
16
RLINEIN
TOP VIEW
(Not to Scale)
SSM2604
NOTES
1. NC = NO CONNECT.
2. FOR PROPER CONNECTION OF THE EXPOSED PAD,
CONNECT TO PCB GROUND LAYER
Figure 6. Pin Configuration
Table 9. Pin Function Descriptions
Pin No. Mnemonic Type Description
1 MCLK/XTI Digital Input Master Clock Input/Crystal Input.
2 XTO Digital Output Crystal Output.
3 DGND Digital Ground Digital Ground.
4 DVDD Digital Supply Digital Core and I/O Buffer Supply.
5 CLKOUT Digital Output Buffered Clock Output.
6 BCLK Digital Input/Output Digital Audio Bit Clock.
DAC Digital Audio Data Input, Playback Function.
8 PBLRC Digital Input/Output DAC Sampling Rate Clock, Playback Function (from Left and Right Channels).
9 RECDAT Digital Output ADC Digital Audio Data Output, Record Function.
10 RECLRC Digital Input/Output ADC Sampling Rate Clock, Record Function (from Left and Right Channels).
11 LOUT Analog Output Line Output for Left Channel.
12 ROUT Analog Output Line Output for Right Channel.
13 AVDD Analog Supply Analog Supply.
14 AGND Analog Ground Analog Ground.
15 VMID Analog Output Midrail Voltage Decoupling Input.
16 RLINEIN Analog Input Line Input for Right Channel.
17 LLINEIN Analog Input Line Input for Left Channel.
18 SDIN Digital Input/Output 2-Wire Control Interface Data Input/Output.
19 SCLK Digital Input 2-Wire Control Interface Clock Input.
20 NC NC No Connection
GND Pad Thermal Pad/Exposed Pad Center Thermal Pad. Connect to PCB ground layer.