SST25PF020B
DS20005135B-page 28 2013 Microchip Technology Inc.
FIGURE 7-2: 8-CONTACT VERY-VERY-THIN SMALL OUTLINE NO-LEAD (WSON)
PACKAGE CODE: QA
Note: 1. All linear dimensions are in millimeters (max/min).
2. Untoleranced dimensions (shown with box surround)
are nominal target dimensions.
3. The external paddle is electrically connected to the
die back-side and possibly to certain V
SS
leads.
This paddle can be soldered to the PC board;
it is suggested to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential can
result in shorts and/or electrical malfunction of the device.
8-wson-5x6-QA-9.0
4.0
1.27 BSC
Pin #1
0.48
0.35
0.076
3.4
5.00 ± 0.10
6.00
± 0.10
0.05 Max
0.70
0.50
0.80
0.70
0.80
0.70
Pin #1
Corner
TOP VIEW BOTTOM VIEW
CROSS SECTION
SIDE VIEW
1mm
0.2
2013 Microchip Technology Inc. DS20005135B-page 29
SST25PF020B
FIGURE 7-3: 8-CONTACT ULTRA-THIN SMALL OUTLINE NO-LEAD (USON)
PACKAGE CODE: Q3A
1mm
0.60
0.45
0.08
Pin # 1
3.00
±0.10
Pin #1
(laser
engraved
see note 2)
2.00
±0.10
0.5 BSC
0.2
0.25
±0.05
8-uson-2x2-Q3A-1.1
0.05 Max
See notes
3 &4
1.60
Note:
1. Similar to JEDEC JEP95 MO-252 variant U2030D, though number of contacts and some dimensions may be different.
2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown.
3. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
6. Lead-frame nominal thickness 0.127mm or 0.15mm (supplier-dependent).
2.45
0.40
±0.05
0.35
±0.05
0.15 max
SST25PF020B
DS20005135B-page 30 2013 Microchip Technology Inc.
TABLE 7-1: REVISION HISTORY
Revision Description Date
A
Initial release of spec
Nov 2012
B
Updated “Product Identification System” on page 26
May 2013

SST25PF020B-80-4C-Q3AE-T

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.3V to 3.6V 2Mbit SPI Serial Flash
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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