©2011 Silicon Storage Technology, Inc. DS25051A 09/11
31
4 Mbit SPI Serial Flash
SST25VF040B
Data Sheet
A
Microchip Technology Company
Figure 29: 8-Lead Small Outline Integrated Circuit (SOIC) 150mil Body Width (5mm x 6mm)
SST Package Code: SA
08-soic-5x6-SA-8
Note: 1. Complies with JEDEC publication 95 MS-012 AA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.
TOP VIEW
SIDE VIEW
END VIEW
5.0
4.8
6.20
5.80
4.00
3.80
Pin #1
Identifier
0.51
0.33
1.27 BSC
0.25
0.10
1.75
1.35
4 places
0.25
0.19
1.27
0.40
45°
4 places
1mm
©2011 Silicon Storage Technology, Inc. DS25051A 09/11
32
4 Mbit SPI Serial Flash
SST25VF040B
Data Sheet
A
Microchip Technology Company
Figure 30:8-Contact Very-very-thin Small Outline No-lead (WSON)
SST Package Code: QA
Note: 1. All linear dimensions are in millimeters (max/min).
2. Untoleranced dimensions (shown with box surround)
are nominal target dimensions.
3. The external paddle is electrically connected to the
die back-side and possibly to certain V
SS
leads.
This paddle can be soldered to the PC board;
it is suggested to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential can
result in shorts and/or electrical malfunction of the device.
8-wson-5x6-QA-9.0
4.0
1.27 BSC
Pin #1
0.48
0.35
0.076
3.4
5.00 ± 0.10
6.00 ± 0.10
0.05 Max
0.70
0.50
0.80
0.70
0.80
0.70
Pin #1
Corner
TOP VIEW BOTTOM VIEW
CROSS SECTION
SIDE VIEW
1mm
0.2
©2011 Silicon Storage Technology, Inc. DS25051A 09/11
33
4 Mbit SPI Serial Flash
SST25VF040B
Data Sheet
A
Microchip Technology Company
Table 17:Revision History
Revision Description Date
00
Initial release of data sheet
Sep 2005
01
Migrated document to a Data Sheet
Updated Surface Mount Solder Reflow Temperature information
Jan 2006
02
Added 8-Lead SOIC (150 mils) package drawing.
Updated Features and Product Description to include new package infor-
mation.
Updated Pin-Assignment, Figure 2
Revised Figure 10 and Figure 11
Jul 2007
03
Updated document to reflect upgraded clock frequency to 80 MHz glob-
ally
Updated Features
Changed maximum frequency to 80 MHz in Table 5 on page 9
Added IDDR3 to Table 10 on page 22
Added 80 MHz column to Table 14 on page 24
Updated Product Ordering Information and Valid Combinations on page 29
Mar 2009
04
Updated Product Ordering Information and Valid Combinations on page 29
Added “Power-Up Specifications” on page 27
Modified High-Speed-Read values in Table 5 on page 9 and “High-
Speed-Read (50/80 MHz)” on page 11
Jun 2009
05
Added 50/33 MHz information throughout.
Separated AC and DC Characteristics for SST25VF040B-50-4C-xxxF &
SST25VF040B-80-4I-xxxE
Oct 2009
06
Updated “Auto Address Increment (AAI) Word-Program”, “End-of-Write
Detection”, and “Hardware End-of-Write Detection” on page 12.
Revised Figures 10 and 11 on page 14.
Updated document to new format.
Feb 2011
A
Removed “Recommended System Power-up Timings” from page 29.
Released document under letter revision system.
Updated Spec number from S71295 to DS25051
Sep 2011

SST25VF040B-80-4I-QAE-T

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7V to 3.6V 4Mbit SPI Serial Flash
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union