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ADCMP563BCPZ-RL7

P1-P3P4-P6P7-P9P10-P12P13-P15
Data Sheet ADCMP563/ADCMP564
Rev. D | Page 13 of 15
TYPICAL APPLICATION CIRCUITS
ADCMP563/
ADCMP564
ALL RESISTORS 50
Ω
OUTPUTS
V
IN
V
REF
LATCH
ENABLE
INPUTS
–2.0V
04650-0-007
Figure 24. High Speed Sampling Circuits
04650-0-008
ALL RESISTORS 50Ω UNLESS OTHERWISE NOTED
OUTPUTS
+V
REF
–V
REF
V
IN
LATCH
ENABLE
INPUTS
ADCMP563/
ADCMP564
ADCMP563/
ADCMP564
–2V
–2V
OUTPUTS
Figure 25. High Speed Window Comparator
04650-0-009
ADCMP564
ALL RESISTORS 50
Ω
, UNLESS OTHERWISE NOTED
OUTPUTS
HYS
V
IN
V
REF
–
2.0V
0
Ω
TO 80kΩ
Figure 26. Adding Hysteresis Using the HYS Control Pin
04650-0-011
V
IN
–5.2V
30Ω
127Ω127Ω
50Ω
30Ω 50Ω
ADCMP563/
ADCMP564
Figure 27. One Method to Interface an ECL Output to an
Instrument with a 50 Ω to Ground Input
ADCMP563/ADCMP564 Data Sheet
Rev. D | Page 14 of 15
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
09-12-2014-A
Figure 28. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
COMPLIANT TO JEDEC STANDARDS MO-137-AD
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
20
1
1
101
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049
(1.25)
0.069 (1.75)
0.053 (1.35)
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
09-12-2014-A
Figure 29. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in inches and (millimeters)
Data Sheet ADCMP563/ADCMP564
Rev. D | Page 15 of 15
1.45
1.30 SQ
1.15
111808-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
3.10
3.00 SQ
2.90
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.30
0.23
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-21)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADCMP563BRQZ −40°C to +85°C 16-Lead QSOP RQ-16
ADCMP563BCPZ-R2 −40°C to +85°C 16-Lead LFCSP 250 Unit Reel CP-16-21 G01
ADCMP563BCPZ-RL7 −40°C to +85°C 16-Lead LFCSP 1,500 Unit Reel CP-16-21 G01
ADCMP563BCPZ-WP
−40°C to +85°C
16-Lead LFCSP 50 Unit Waffle Pack
CP-16-21
G01
ADCMP564BRQZ −40°C to +85°C 20-Lead QSOP RQ-20
EVAL-ADCMP563BRQZ Evaluation Board
EVAL-ADCMP564BRQZ Evaluation Board
1
Z = RoHS Compliant Part.
©2007–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04650-0-4/16(D)
P1-P3P4-P6P7-P9P10-P12P13-P15

ADCMP563BCPZ-RL7

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Manufacturer:
Analog Devices Inc.
Description:
Analog Comparators IC Dual High Spd ECL
Lifecycle:
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