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NX3V1G66GM,132

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
NX3V1G66 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 4 November 2011 13 of 18
NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
13. Package outline
Fig 22. Package outline SOT353-1 (TSSOP5)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(1)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
e
1
1.3
2.25
2.0
0.60
0.15
7°
0°
0.1 0.10.30.425
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.46
0.21
SOT353-1 MO-203 SC-88A
00-09-01
03-02-19
w M
b
p
D
Z
e
e
1
0.15
13
5
4
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v M
A
X
A
y
1.5 3 mm0
scale
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
1.1
NX3V1G66 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 4 November 2011 14 of 18
NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
Fig 23. Package outline SOT886 (XSON6)
terminal 1
index area
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT886
MO-252
SOT886
04-07-15
04-07-22
DIMENSIONS (mm are the original dimensions)
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
D
E
e
1
e
A
1
b
L
L
1
e
1
0 1 2 mm
scale
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm
0.25
0.17
1.5
1.4
0.35
0.27
A
1
max
b E
1.05
0.95
D
ee
1
L
0.40
0.32
L
1
0.50.6
A
(1)
max
0.5 0.04
1
6
2
5
3
4
6×
(2)
4×
(2)
A
NX3V1G66 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 4 November 2011 15 of 18
NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
14. Abbreviations
15. Revision history
Table 13. Abbreviations
Acronym Description
CDM Charged Device Model
CMOS Complementary Metal-Oxide Semiconductor
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
PDA Personal Digital Assistant
TTL Transistor-Transistor Logic
Table 14. Revision history
Document ID Release date Data sheet status Change notice Supersedes
NX3V1G66 v.7 20111104 Product data sheet - NX3V1G66 v.6
Modifications:
• Legal pages updated.
NX3V1G66 v.6 20101221 Product data sheet - NX3V1G66 v.5
NX3V1G66 v.5 20100324 Product data sheet - NX3V1G66 v.4
NX3V1G66 v.4 20100208 Product data sheet - NX3V1G66 v.3
NX3V1G66 v.3 20090409 Product data sheet - NX3V1G66 v.2
NX3V1G66 v.2 20080728 Product data sheet - NX3V1G66 v.1
NX3V1G66 v.1 20080421 Product data sheet - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

NX3V1G66GM,132

Mfr. #:
Buy NX3V1G66GM,132
Manufacturer:
NXP Semiconductors
Description:
Analog Switch ICs Analog SW Single SPST 3.6V 6-Pin
Lifecycle:
New from this manufacturer.
Delivery:
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