MT9VDDT3272AY-335K1

PDF: 09005aef808f912d/Source: 09005aef808f8ccd Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD9C32_64x72A.fm - Rev. F 10/08 EN
7 ©2003 Micron Technology, Inc. All rights reserved.
256MB, 512MB (x72, ECC, SR) 184-Pin DDR SDRAM UDIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed in Table 7 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated in each devices data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
Notes: 1. For further information, refer to technical note TN-00-08: “Thermal Applications,” available
on Micron’s Web site.
Table 7: Absolute Maximum Ratings
Symbol Parameter Min Max Units
Vdd/Vddq
Vdd/Vddq supply voltage relative to Vss
–1.0 +3.6 V
Vin, Vout
Voltage on any pin relative to Vss
–0.5 +3.2 V
Ii
Input leakage current; Any input 0V Vin Vdd;
Vref input 0V Vin 1.35V (All other pins not under
test = 0V)
Address inputs,
RAS#, CAS#, WE#, BA,
S#, CKE
–18 +18 µA
CK, CK#
–6 +6
DM
–2 +2
Ioz
Output leakage current; 0V Vout Vddq; DQ are
disabled
DQ, DQS
–5 +5 µA
T
A
DRAM ambient operating temperature
1
Commercial
0+70°C
Industrial
–40 +85 °C
PDF: 09005aef808f912d/Source: 09005aef808f8ccd Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD9C32_64x72A.fm - Rev. F 10/08 EN
8 ©2003 Micron Technology, Inc. All rights reserved.
256MB, 512MB (x72, ECC, SR) 184-Pin DDR SDRAM UDIMM
Electrical Specifications
DRAM Operating Conditions
Recommended AC operating conditions are given in the DDR component data sheets.
Component specifications are available on Microns Web site. Module speed grades
correlate with component speed grades, as shown in Table 8.
Design Considerations
Simulations
Micron memory modules are designed to optimize signal integrity through carefully
designed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level.
Micron encourages designers to simulate the signal characteristics of the systems
memory bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to
ensure the required supply voltage is maintained.
Table 8: Module and Component Speed Grades
DDR components may exceed the listed module speed grades
Module Speed Grade Component Speed Grade
-40B -5B
-335 -6
-262 -75E
-26A -75Z
-265 -75
PDF: 09005aef808f912d/Source: 09005aef808f8ccd Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD9C32_64x72A.fm - Rev. F 10/08 EN
9 ©2003 Micron Technology, Inc. All rights reserved.
256MB, 512MB (x72, ECC, SR) 184-Pin DDR SDRAM UDIMM
Electrical Specifications
Idd Specifications
Table 9: Idd Specifications and Conditions – 256MB (Die Revision K)
Values are for the MT46V32M8 DDR SDRAM only and are computed from values specified in the
256Mb (32 Meg x 8) component data sheet
Parameter/Condition Symbol -40B -335 Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing once per clock cycle; Address
and control inputs changing once every 2 clock cycles
Idd0 900 810 mA
Operating one bank active-read-precharge current: BL = 2;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Iout = 0mA; Address and control inputs changing once per clock
cycle
Idd1 1080 1035 mA
Precharge power-down standby current: All device banks idle; Power-down
mode;
t
CK =
t
CK (MIN); CKE = LOW
Idd2P 36 36 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK =
t
CK (MIN);
CKE = HIGH; Address and other control inputs changing once per clock cycle
;
Vin
=
Vref
for DQ, DM, and DQS
Idd2F 450 450 mA
Active power-down standby current: One device bank active; Power-down
mode;
t
CK =
t
CK (MIN); CKE = LOW
Idd3P 315 270 mA
Active standby current: CS# = HIGH; CKE = HIGH; One device bank active;
t
RC =
t
RAS (MAX);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing twice per
clock cycle; Address and other control inputs changing once per clock cycle
Idd3N 540 495 mA
Operating burst read current: BL = 2; Continuous burst reads; One device
bank active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN); Iout = 0mA
Idd4R 1620 1440 mA
Operating burst write current: BL = 2; Continuous burst writes; One device
bank active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing twice per clock cycle
Idd4W 1620 1440 mA
Auto refresh current
t
RFC =
t
RFC (MIN)
Idd5 1440 1440 mA
t
RFC = 7.8125µs
Idd5A 54 54 mA
Self refresh current: CKE 0.2V
Idd6 36 36 mA
Operating bank interleave read current: Four device bank interleaving reads
(BL = 4) with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Address and
control inputs change only during active READ or WRITE commands
Idd7 2610 2430 mA

MT9VDDT3272AY-335K1

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR SDRAM 256MB 184UDIMM
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