HMC8205BF10 Data Sheet
Rev. C | Page 10 of 14
13790-039
50
30
32
34
36
38
40
42
44
46
48
0 1 2 3 4
5 6
4dB COMPRESSION POINT (dBm)
FREQUENCY (GHz)
28V
40V
45V
50V
55V
Figure 33. 4 dB Compression Point vs. Frequency at Various Supply Voltages
55
30
35
40
45
50
0 1 2 3 4 5
6
OUTPUT THIRD-ORDER INTERCEPT POINT (dB)
FREQUENCY (GHz)
+85°C
+25°C
–40°C
13790-046
Figure 34. Output Third-Order Intercept Point vs. Frequency at 32 dBm
Output Power at Various Temperatures
20
25
30
35
40
45
50
55
60
20 25 30 35 40
OUTPUT THIRD-ORDER INTERCEPT POINT (dB)
OUTPUT POWER PER TONE (dBm)
300MHz
1GHz
2GHz
3GHz
4GHz
5GHz
6GHz
13790-047
Figure 35. Output Third-Order Intercept Point vs. Output Power per Tone at
Various Frequencies
0
10
20
30
40
50
60
70
20 25 30
35
40
IMD3 (dBc)
OUTPUT POWER (dBm)
300MHz
1GHz
2
GH
z
3GHz
4GHz
5
GH
z
6GHz
13790-048
Figure 36. Upper Third-Order Intermodulation (IMD3) vs. Output Power at
Various Frequencies
4.5
–0.5
0.5
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
10 15 20
25
30
35
GATE CURRENT (mA)
INPUT POWER (dBm)
13790-049
+85°C
+25°C
–40°C
Figure 37. Gate Current vs. Input Power at Various Temperatures
13790-050
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–6.0 –5.0 –4.0 –3.0 –2.0
–1.0–5.0 –4.5 –3.5 –2.5 –1.5
DRAIN SUPPLY CURRENT (A)
GATE VOLTAGE (V)
Figure 38. Drain Supply Current vs. Gate Voltage
Data Sheet HMC8205BF10
Rev. C | Page 11 of 14
THEORY OF OPERATION
The HMC8205BF10 is a 35 W, GaN power amplifier consisting
of two cascaded gain stages. The first stage requires only a single
positive drain supply, which also internally generates gate bias
such that a first stage quiescent drain current of approximately
400 mA results for a 50 V drain voltage. The second stage has a
distributed architecture that is biased by a separate positive
drain supply plus an externally applied negative gate supply.
When 50 V is used to bias the first and second stage drains
together, adjust the negative voltage applied to V
GG
1 to obtain a
total quiescent drain current of 1300 mA.
W
hen biased as previously described, the device operates in
Class A/B, resulting in maximum PAE at saturation. The
HMC8205BF10 features integrated RF chokes for each drain
plus on-chip dc blocking of the RFIN and RFOUT ports.
Capacitive bypassing of the bias supplies improves performance
and reduces the required external component count.
The HMC8205BF10 is not rated for moisture sensitivity level. It
is a nonhermetic, air cavity device, not surface mountable or
suitable for use in a solder reflow process. The package body
material is Tungsten Copper 85/15.
HMC8205BF10 Data Sheet
Rev. C | Page 12 of 14
APPLICATIONS INFORMATION
The first and second stage drain bias voltages are applied via the
V
DD
1 and V
DD
2 pins, respectively, and the second stage gate bias
voltage is applied via the V
GG
1 pin. A single supply can be used
for both drains. Capacitive bypassing of all drain and gate pins
is required (see Figure 39). When the HMC8205BF10 is used in
a 50 Ω system, external matching components are not required
for the RFIN and RFOUT ports.
The following is the recommended power-up bias sequence:
1. Connect to ground.
2. Set V
GG
1 to 8 V to pinch off the second stage drain
current, I
DD
2.
3. Set V
DD
1 and V
DD
2 to 50 V (I
DD
2 is pinched off, and the
first stage drain current I
DD
1 is approximately 400 mA).
4. Adjust V
GG
1 with a more positive voltage (approximately
2.5 V) until a total quiescent I
DQ
= I
DD
1 + I
DD
2 = 1300 mA
is obtained.
5. Apply the RF signal.
The following is the recommended power-down bias sequence:
1. Turn off the RF signal.
2. Set V
GG
1 to 8 V to pinch off I
DD
2 (I
DD
1 remains
approximately 400 mA).
3. Set V
DD
1 and V
DD
2 to 0 V.
4. Set V
GG
1 t o 0 V.
Unless otherwise noted, all measurements and data shown in
this data sheet were taken using the evaluation PCB shown in
Figure 39. The bias conditions, shown in Table 1 and Table 2,
are the operating points recommended to optimize the overall
performance of the HMC8205BF10.
Unless otherwise noted, the data shown in the Specifications
section was taken using the recommended bias conditions.
Operation of the HMC8205BF10 at other bias conditions can
provide performance that differs from what is shown in this
data sheet. Some applications can benefit from the reduced
power consumption afforded by the use of lower drain voltages
and/or lower drain currents. To understand the trade-offs
between power consumption and performance, see Theory of
Operation section.
The evaluation printed circuit board (PCB) provides the
HMC8205BF10 (see Figure 39), allowing easy operation using
standard dc power supplies and 50 Ω RF test equipment.
APPLICATION CIRCUIT
1
2
3
4
5
V
DD
2
RFIN
NC
NC
NC
NC
RFOUT
10
9
8
7
6
PACKAGE BASE
GND
C2
1µF
C3
0.01µF
C6
100pF
C8
0.01µF
C11
1µF
C5
100pF
C7
0.01µF
C9
1µF
C12
1µF
HMC8205BF10
13790-020
V
GG
1
V
DD
1
Figure 39. Typical Application Circuit

HMC8205BF10

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Amplifier 0.3-6GHz 30W PA w/ Driver
Lifecycle:
New from this manufacturer.
Delivery:
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