Data Sheet HMC8205BF10
Rev. C | Page 13 of 14
EVALUATION PCB
Use RF circuit design techniques for the PCB. Provide 50 Ω
impedance for the signal lines and directly connect the package
ground leads and exposed paddle to the ground plane (see
Figure 40). Use a sufficient number of via holes to connect the
top and bottom ground planes. The evaluation PCB shown in
Figure 40 is available from Analog Devices, Inc., upon request.
See Table 7 for the bill of materials of the EV1HMC8205BF10.
Table 7. Bill of Materials for Evaluation PCB
EV1HMC8205BF10
RF IN, RF OUT Subminiature A (SMA) connectors
P1 DC pins
JP1, JP2, JP3 Preform jumpers
C2, C9, C11, C12 1 μF capacitors, 0805 package
C3, C7, C8 0.01 μF capacitors, 0402 package
C5, C6 100 pF capacitors, 0603 package
U1 HMC8205BF10
PCB EV1HMC8205BF10 Rogers 4350 or
Arlon 25FR
Figure 40. Evaluation PCB
