NCV7520
www.onsemi.com
38
PACKAGE DIMENSIONS
CASE 136AB
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL BE 0.08 MAX. AT MMC. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT
LEAD IS 0.07.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH, PRO
TRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR
GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS
D1 AND E1 ARE MAXIMUM PLASTIC BODY SIZE INCLUDING
MOLD MISMATCH.
5. THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE
BOTTOM PACKAGE SIZE BY AS MUCH AS 0.15.
6. DATUMS A-B AND D ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEAT
ING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
8. DIMENSIONS D AND E TO BE DETERMINED AT DATUM PLANE C.
DIM MIN MAX
MILLIMETERS
D1 5.00 BSC
e 0.50 BSC
E1 5.00 BSC
A --- 1.20
b 0.15 0.27
A2 0.95 1.05
A1 0.00 0.15
L 0.45 0.75
M 0 7
D 7.00 BSC
E 7.00 BSC
L2 0.25 BSC
__
E3 --- 0.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
D3 0.20 REF
D2 3.40 REF
E2 3.40 REF
32X
0.50
PITCH
3.70
1.00
1
DIMENSIONS: MILLIMETERS
0.28
32X
7.40
7.40
1.85
RECOMMENDED
ALTERNATE CONSTRUCTIONS
D3
DETAIL B
D3
E3
A2
A1
L2
L
DETAIL A
S
0.05
H
M
32X
NOTE 7
b
SEATING
PLANE
DETAIL A
0.05
C0.08
C
32X
A-B
0.08
CD
D2
E2
BOTTOM VIEW
SIDE VIEW
DETAIL B
NOTE 3
e
A
1
9
17
25
32
4X 8 TIPS
4X
A-B0.10 DH
A-B0.20 DC
A
B
D
PIN ONE
INDICATOR
TOP VIEW
D
EE1
D1
NOTES 4 & 6
NOTES 4 & 6
NOTE 8
NOTE 8
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NCV7520/D
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