NCV7520
www.onsemi.com
5
MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating
Value Unit
DC Supply − V
LOAD
−0.3 to 48 V
DC Supply − V
CC1
, V
CC2
, V
DD
−0.3 to 5.8 V
Difference Between V
CC1
and V
CC2
±0.3 V
Difference Between GND (Substrate) and V
SS
±0.3 V
Drain Input Clamp Forward Voltage Transient (≤2 ms, ≤1% duty) 78 V
Drain Input Clamp Forward Current Transient (≤2 ms, ≤1% duty) 10 mA
Drain Input Clamp Energy Repetitive (≤2 ms, ≤1% duty) 1.56 mJ
Drain Input Clamp Reverse Current V
DRNX
≥ −1.0 V −50 mA
Input Voltage (Any Input Other Than Drain) −0.3 to 5.8 V
Output Voltage (Any Output) −0.3 to 5.8 V
Junction Temperature, T
J
−40 to 150 °C
Storage Temperature, T
STG
−65 to 150 °C
Peak Reflow Soldering Temperature: Lead−free 60 to 150 seconds at 217°C (Note 1) 260 peak °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ATTRIBUTES
Characteristic Conditions
Package
QFN32 TQFP32
ESD Capability
Human Body Model per AEC−Q100−002
Drain Feedback Pins (Note 3)
All Other Pins
≥ ±4.0 kV
≥ ±2.0 kV
≥ ±4.0 kV
≥ ±2.0 kV
Moisture Sensitivity (Note 2) MSL3 MSL3
Package Thermal Resistance − Still−air
Junction−to−Ambient, Rq
JA
Junction−to−Exposed Pad, RY
JPAD
(Note 4)
(Note 5)
62°C/W
26°C/W
1.8°C/W
64°C/W
30°C/W
5.2°C/W
2. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
3. With GND & V
SS
pins tied together − path between drain feedback pins and GND, or between drain feedback pins.
4. 2S0P 2−layer PCB based on JESD51−3, 80 x 80 x 1.6 mm FR4, 20 thermal vias, 2 oz. Signal, 2 oz. 400 mm
2
bottom spreader.
5. 2S2P 4−layer PCB based on JESD51−7, 80 x 80 x 1.6 mm FR4, 20 thermal vias, 2 oz. Signal, 1 oz. 6400 mm
2
internal spreaders.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
LOAD
Diagnostic References and Currents Power Supply Voltage 7.5 36.0 V
V
DRNX
Drain Input Feedback Voltage −0.3 60 V
V
CC1
Main Power Supply Voltage 4.75 5.25 V
V
CC2
Gate Drivers Power Supply Voltage V
CC1
− 0.3 V
CC1
+ 0.3 V
V
DD
Serial Output Driver Power Supply Voltage 3.0 V
CC1
V
V
FLTREF
Fault Detect Threshold Reference Voltage 0.35 2.75 V
V
IN
High Logic High Input Voltage 2.0 V
CC1
V
V
IN
Low Logic Low Input Voltage 0 0.8 V
T
A
Ambient Still−air Operating Temperature −40 125 °C
t
RESET
Startup Delay at Power−on Reset (POR) (Note 6) − 200
ms
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Minimum wait time until device is ready to accept serial input data.
