NTLLD4901NF
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12
PACKAGE DIMENSIONS
WDFN8 3x3, 0.65P
CASE 511BP
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.05 AND 0.15 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. POSITIONAL TOLERANCE APPLIES TO ALL
OF THE EXPOSED PADS.
A
D
E
B
C0.15
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
K
D2
E2
C
C0.15
C0.10
C0.08
A1
SEATING
PLANE
NOTE 3
b
8X
0.10 C
0.05 C
A
B
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
b 0.30 0.50
D 3.00 BSC
D2 2.35 2.55
E 3.00 BSC
E2 0.90 1.10
e 0.65 BSC
L 0.20 0.40
1
4
8
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
PITCH
1.15
3.30
1
DIMENSIONS: MILLIMETERS
0.43
NOTE 4
0.50
5X
DETAIL A
A3 0.20 REF
A3
A
DETAIL B
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 0.00 0.15
e
RECOMMENDED
G 0.43 BSC
5
2.60
E3 0.40 0.60
G2 0.68 BSC
K 0.20 −−−
e/2
E3
G
G2
A
M
0.10 BC
M
M
A
M
0.10 BC
NOTE 5
NOTE 5
1.80
0.50
6X
0.68
0.65
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