AX8052F131
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13
Table 13. MICROCONTROLLER
Symbol Description Condition Min Typ Max Units
T
SYSCLKL
SYSCLK Low 27 ns
T
SYSCLKH
SYSCLK High 21 ns
T
SYSCLKP
SYSCLK Period 47 ns
T
FLWR
FLASH Write Time 2 Bytes 20
ms
T
FLPE
FLASH Page Erase 1 kBytes 2 ms
T
FLE
FLASH Secure Erase 64 kBytes 10 ms
T
FLEND
FLASH Endurance: Erase Cycles 10 000 100 000 Cycles
T
FLRETroom
FLASH Data Retention
25°C
See Figure 3 for the lower limit
set by the memory qualification
100
Years
T
FLREThot
85°C
See Figure 3 for the lower limit
set by the memory qualification
10
Figure 3. FLASH Memory Qualification Limit for Data Retention after 10k Erase Cycles
10
100
1000
10000
100000
15 25 35 45 55 65 75 85
Temperature [5C]
Data retention time [years]
AX8052F131
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Table 14. ADC / COMPARATOR / TEMPERATURE SENSOR
Symbol Description Condition Min Typ Max Units
ADCSR ADC sampling rate GPADC mode 30 500 kHz
ADCSR_T ADC sampling rate temperature sensor mode 10 15.6 30 kHz
ADCRES ADC resolution 10 Bits
V
ADCREF
ADC reference voltage & comparator internal
reference voltage
0.95 1 1.05 V
Z
ADC00
Input capacitance 2.5 pF
DNL Differential nonlinearity ± 1 LSB
INL Integral nonlinearity ± 1 LSB
OFF Offset 3 LSB
GAIN_ERR Gain error 0.8 %
ADC in Differential Mode
V
ABS_DIFF
Absolute voltages & common mode voltage in
differential mode at each input
0 VDD_IO V
V
FS_DIFF01
Full swing input for differential signals
Gain x1 500 500 mV
V
FS_DIFF10
Gain x10 50 50 mV
ADC in Single Ended Mode
V
MID_SE
Mid code input voltage in single ended mode 0.5 V
V
IN_SE00
Input voltage in single ended mode 0 VDD_IO V
V
FS_SE01
Full swing input for single ended signals Gain x1 0 1 V
Comparators
V
COMP_ABS
Comparator absolute input voltage 0 VDD_IO V
V
COMP_COM
Comparator input common mode 0 VDD_IO
0.8
V
V
COMPOFF
Comparator input offset voltage 20 mV
Temperature Sensor
T
RNG
Temperature range 40 85 °C
T
RES
Temperature resolution 0.1607 °C/LSB
T
ERR_CAL
Temperature error Factory calibration
applied
2 2 °C
AX8052F131
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15
CIRCUIT DESCRIPTION
The AX8052F131 is a single chip ultralowpower
RFmicrocontroller SoC primarily for use in SRD bands.
The onchip transmitter consists of a fully integrated RF
frontend with modulator, and demodulator. Base band data
processing is implemented in an advanced and flexible
communication controller that enables user friendly
communication.
The AX8052F131 contains a high speed microcontroller
compatible to the industry standard 8052 instruction set. It
contains 64 kBytes of FLASH and 8.25 kBytes of internal
SRAM.
The AX8052F131 features 3 16bit general purpose
timers with SD capability, 2 output compare units for
generating PWM signals, 2 input compare units to record
timings of external signals, 2 16bit wakeup timers, a
watchdog timer, 2 UARTs, a Master/Slave SPI controller, a
10bit 500 kSample/s A/D converter, 2 analog comparators,
a temperature sensor, a 2 channel DMA controller, and a
dedicated AES crypto controller. Debugging is aided by a
dedicated hardware debug interface controller that connects
using a 3wire protocol (1 dedicated wire, 2 shared with
GPIO) to the PC hosting the debug software.
While the radio carrier can only be clocked by the crystal
oscillator (carrier stability requirements dictate a high
stability reference clock in the MHz range), the
microcontroller and its peripherals provide extremely
flexible clocking options. The system clock that clocks the
microcontroller, as well as peripheral clocks, can be selected
from one of the following clock sources: the crystal
oscillator, an internal high speed 20 MHz oscillator, an
internal low speed 640 Hz/10 kHz oscillator, or the low
frequency crystal oscillator. Prescalers offer additional
flexibility with their programmable divide by a power of two
capability. To improve the accuracy of the internal
oscillators, both oscillators may be slaved to the crystal
oscillator.
AX8052F131 can be operated from a 2.2 V to 3.6 V power
supply over a temperature range of –40°C to 85°C, it
consumes 11 45 mA for transmitting, depending on the
output power.
The AX8052F131 features make it an ideal interface for
integration into various battery powered SRD solutions such
as ticketing or as transmitter for telemetric applications e.g.
in sensors. As primary application, the transmitter is
intended for UHF radio equipment in accordance with the
European Telecommunication Standard Institute (ETSI)
specification EN 300 2201 and the US Federal
Communications Commission (FCC) standard CFR47, part
15. The use of AX8052F131 in accordance to FCC Par
15.247, allows for improved range in the 915 MHz band.
Additionally AX8052F131 is compatible with the low
frequency standards of 802.15.4 (ZigBee) and suited for
systems targeting compliance with Wireless MBus
standard EN 137574:2005
The AX8052F131 sends data in frames. This standard
operation mode is called Frame Mode. Pre and post ambles
as well as checksums can be generated automatically.
AX8052F131 supports any data rate from 1 kbps to
350 kbps for FSK and MSK, from 1 kbps to 2000 kbps for
ASK and from 10 kbps to 2000 kbps for PSK. To achieve
optimum performance for specific data rates and
modulation schemes several register settings to configure
the AX8052F131 are necessary, they are outlined in the
following, for details see the AX5031 Programming
Manual.
Spreading is possible on all data rates and modulation
schemes. The net transfer rate is reduced by a factor of 15 in
this case. For ZigBee either 600 or 300 kbps modes have to
be chosen.
The transmitter supports multichannel operation for all
data rates and modulation schemes.
Microcontroller
The AX8052 microcontroller core executes the industry
standard 8052 instruction set. Unlike the original 8052,
many instructions are executed in a single cycle. The system
clock and thus the instruction rate can be programmed freely
from DC to 20 MHz.
Memory Architecture
The AX8052 Microcontroller features the highest
bandwidth memory architecture of its class. Figure 4 shows
the memory architecture. Three bus masters may initiate bus
cycles:
The AX8052 Microcontroller Core
The Direct Memory Access (DMA) Engine
The Advanced Encryption Standard (AES) Engine
Bus targets include:
Two individual 4 kBytes RAM blocks located in X
address space, which can be simultaneously accessed
and individually shut down or retained during sleep
mode
A 256 Byte RAM located in internal address space,
which is always retained during sleep mode
A 64 kBytes FLASH memory located in code space.
Special Function Registers (SFR) located in internal
address space accessible using direct address mode
instructions
Additional Registers located in X address space
(X Registers)
The upper half of the FLASH memory may also be
accessed through the X address space. This simplifies and
makes the software more efficient by reducing the need for
generic pointers.
NOTE: Generic pointers include, in addition to the
address, an address space tag.

AX8052F131-2-TX30

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Microcontrollers - MCU 8-bit Microcontrollers - MCU RF-MICROCONTROLLER
Lifecycle:
New from this manufacturer.
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