CY28409
Document #: 38-07445 Rev. *D Page 16 of 17
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
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Purchase of I
2
C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips
I
2
C Patent Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
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as defined by Philips. Intel and Pentium are registered trademarks of Intel Corporation. All product and company names mentioned
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Package Drawings and Dimensions
56-lead Shrunk Small Outline Package O56
51-85062-*C
SEATING
PLANE
1
BSC
0°-8°
MAX.
GAUGE PLANE
28
29 56
1.100[0.043]
0.051[0.002]
0.851[0.033]
0.508[0.020]
0.249[0.009]
7.950[0.313]
0.25[0.010]
6.198[0.244]
13.894[0.547]
8.255[0.325]
5.994[0.236]
0.950[0.037]
0.500[0.020]
14.097[0.555]
0.152[0.006]
0.762[0.030]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
0.170[0.006]
0.279[0.011]
0.20[0.008]
0.100[0.003]
0.200[0.008]
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.42gms
PART #
Z5624 STANDARD PKG.
ZZ5624 LEAD FREE PKG.
56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56
51-85060-*C
